Title:
ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2021/193782
Kind Code:
A1
Abstract:
The present invention relates to an adhesive tape which has a layered structure wherein an adhesive layer, a first film layer (I), a base material layer and a second film layer (II) are sequentially arranged in this order. The base material layer satisfies a specific requirement; the ratio of the thickness (a) from the first film layer (I)-side surface of the base material layer to the outer surface of the adhesive layer to the thickness (b) from the second film layer (II)-side surface of the base material layer to the outer surface of the second film layer (II), namely (a)/(b) is not less than 1.7 or not more than 0.6; and at least one layer in the layered structure contains a flame retardant (C).
Inventors:
SAKAI JUNICHIRO (JP)
Application Number:
PCT/JP2021/012431
Publication Date:
September 30, 2021
Filing Date:
March 24, 2021
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B32B27/00; C09J7/29; C09J7/38; C09J133/00
Domestic Patent References:
| WO2015098983A1 | 2015-07-02 | |||
| WO2018117264A1 | 2018-06-28 | |||
| WO2018117264A1 | 2018-06-28 |
Foreign References:
| JP2002138263A | 2002-05-14 | |||
| JP2002371250A | 2002-12-26 | |||
| JP2020193331A | 2020-12-03 | |||
| JPH11323269A | 1999-11-26 | |||
| JP2008024827A | 2008-02-07 | |||
| JP2020055205A | 2020-04-09 |
Other References:
See also references of EP 4129652A4
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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