Title:
ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2022/244756
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive tape which exhibits excellent peeling performance with respect to a chip component, and which can suppress adhesive residue on a chip component. The present invention is an adhesive tape which has an adhesive layer. The adhesive layer contains a crosslinking agent and an A-B-A type block copolymer having a block A, which has a structure derived from an aromatic vinyl monomer, and a block B, which has a structure derived from a (meth)acrylic monomer. The block B contains a structure derived from a crosslinkable functional group-containing monomer. The adhesive layer has a tensile modulus of elasticity of 0.008-2 MPa.
Inventors:
UCHIDA NORIYUKI (JP)
Application Number:
PCT/JP2022/020469
Publication Date:
November 24, 2022
Filing Date:
May 17, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J11/08; C09J7/38; C09J125/02; C09J133/00; C09J133/06; C09J153/00
Domestic Patent References:
| WO2020032163A1 | 2020-02-13 | |||
| WO2020218430A1 | 2020-10-29 | |||
| WO2020059791A1 | 2020-03-26 | |||
| WO2022102691A1 | 2022-05-19 |
Foreign References:
| JP2020132713A | 2020-08-31 | |||
| JP2018098225A | 2018-06-21 | |||
| JP2018080330A | 2018-05-24 | |||
| JP2002241451A | 2002-08-28 | |||
| JP2001115124A | 2001-04-24 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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