Title:
ADHESIVE FOR TEMPORARY FIXING, ADHESIVE FILM, ADHESIVE SUPPORTING BODY, LAMINATE AND KIT
Document Type and Number:
WIPO Patent Application WO/2016/194917
Kind Code:
A1
Abstract:
Provided are: an adhesive for temporary fixing, which has excellent releasability at room temperature, while having excellent bondability; and an adhesive film, an adhesive supporting body, a laminate and a kit, each of which uses this adhesive for temporary fixing.
An adhesive for temporary fixing, which contains: a compound that is in a liquid state at 25°C and contains a silicon atom; and an elastomer X that contains a repeating unit derived from styrene at a ratio of from 50% by mass to 95% by mass (inclusive) relative to all the repeating units.
Inventors:
IWAI YU (JP)
KAMOCHI YOSHITAKA (JP)
KAMOCHI YOSHITAKA (JP)
Application Number:
PCT/JP2016/066089
Publication Date:
December 08, 2016
Filing Date:
June 01, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09J125/08; B32B27/00; B32B27/30; C09J7/20; C09J11/06; C09J11/08; C09J153/00; C09J183/04; H01L21/304
Domestic Patent References:
WO2014168069A1 | 2014-10-16 |
Foreign References:
JPH07188631A | 1995-07-25 | |||
JP2014037458A | 2014-02-27 | |||
JP2004296549A | 2004-10-21 | |||
JP2015214675A | 2015-12-03 | |||
JPH04320473A | 1992-11-11 | |||
JP2001323227A | 2001-11-22 | |||
JP2015013977A | 2015-01-22 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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