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Patent Searching and Data


Title:
ADHESIVE FOR TEMPORARY FIXING, ADHESIVE FILM, ADHESIVE SUPPORTING BODY, LAMINATE AND KIT
Document Type and Number:
WIPO Patent Application WO/2016/194917
Kind Code:
A1
Abstract:
Provided are: an adhesive for temporary fixing, which has excellent releasability at room temperature, while having excellent bondability; and an adhesive film, an adhesive supporting body, a laminate and a kit, each of which uses this adhesive for temporary fixing. An adhesive for temporary fixing, which contains: a compound that is in a liquid state at 25°C and contains a silicon atom; and an elastomer X that contains a repeating unit derived from styrene at a ratio of from 50% by mass to 95% by mass (inclusive) relative to all the repeating units.

Inventors:
IWAI YU (JP)
KAMOCHI YOSHITAKA (JP)
Application Number:
PCT/JP2016/066089
Publication Date:
December 08, 2016
Filing Date:
June 01, 2016
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C09J125/08; B32B27/00; B32B27/30; C09J7/20; C09J11/06; C09J11/08; C09J153/00; C09J183/04; H01L21/304
Domestic Patent References:
WO2014168069A12014-10-16
Foreign References:
JPH07188631A1995-07-25
JP2014037458A2014-02-27
JP2004296549A2004-10-21
JP2015214675A2015-12-03
JPH04320473A1992-11-11
JP2001323227A2001-11-22
JP2015013977A2015-01-22
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
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