ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE BY USING SAME

Title:

ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE BY USING SAME

Document Type and Number:

WIPO Patent Application WO/2021/221460

Kind Code:

A1

Abstract:

The present invention relates to an adhesive transfer film for bonding a semiconductor chip and a spacer to a substrate and a method for manufacturing a power module substrate by using same, the adhesive transfer film being obtained by manufacturing a Ag sintering paste in the form of a film. The present invention can reduce the process time by minimizing a sintering process, and can reduce equipment investment cost.

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Inventors:

JUN YOUNGHWAN (KR)
WOO KYUNGWHAN (KR)
SONG YONGSUL (KR)

Application Number:

PCT/KR2021/005373

Publication Date:

November 04, 2021

Filing Date:

April 28, 2021

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Assignee:

AMOSENSE CO LTD (KR)

International Classes:

C09J7/25; B41M5/382; C08L101/00; C09D1/00; C09J1/00; H01L23/00; H01L23/482

Domestic Patent References:

WO2019180914A1

2019-09-26

Foreign References:

KR20200039735A	2020-04-16
KR20190110376A	2019-09-30
KR20190130152A	2019-11-21
KR20170125350A	2017-11-14

Attorney, Agent or Firm:

KIM, Churchill (KR)

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