Title:
AG ALLOY SPUTTERING TARGET, AND AG ALLOY FILM
Document Type and Number:
WIPO Patent Application WO/2020/162206
Kind Code:
A1
Abstract:
The present invention is characterised by comprising: 1.0-5.0 atomic%, inclusive, of Mg; and 0.10-5.00 atomic%, inclusive, of Au, the remainder being Ag and unavoidable impurities. 0.01-0.15 atomic%, inclusive, of Ca may also be included. Also, the amount of oxygen included may be 0.010 mass% or less.
Inventors:
TOSHIMORI YUTO (JP)
NONAKA SOHEI (JP)
NONAKA SOHEI (JP)
Application Number:
PCT/JP2020/002330
Publication Date:
August 13, 2020
Filing Date:
January 23, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C23C14/34; C22C5/06; C22F1/00; C22F1/14; C23C14/06; H01L21/285
Foreign References:
JP2002129259A | 2002-05-09 | |||
JP2002140929A | 2002-05-17 | |||
JP2019020063A | 2019-02-07 | |||
JP2006028641A | 2006-02-02 | |||
JPH09291356A | 1997-11-11 | |||
JPH10239697A | 1998-09-11 | |||
JP2016040411A | 2016-03-24 |
Other References:
See also references of EP 3922747A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
Download PDF:
Previous Patent: OPTIMIZATION DEVICE, METHOD, AND PROGRAM
Next Patent: COMMUNICATION SYSTEM AND METHOD OF VERIFYING CONTINUITY
Next Patent: COMMUNICATION SYSTEM AND METHOD OF VERIFYING CONTINUITY