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Title:
AGENT FOR BOTH IMPARTING ELECTROSTATIC APPLICABILITY AND IMPROVING WATER RESISTANCE OF FILM, ELECTROSTATICALLY COATED RESIN MOLDINGS, AND PROCESS FOR ELECTROSTATIC COATING
Document Type and Number:
WIPO Patent Application WO/1999/046328
Kind Code:
A1
Abstract:
An agent for both imparting electrostatic applicability and improving water resistance of film, which comprises 100 parts by weight of (A) an aromatic polyether ester amide derived from a polyamide having terminal carboxyl groups and a number-average molecular weight of 500 to 5,000 and a bisphenol-alkylene oxide adduct having a number-average molecular weight of 1,600 to 3,000 and 5 to 100 parts by weight of a vinyl copolymer comprising as the essential constituents (b1) a sulfonated vinyl monomer or a salt thereof and (b2) at least one monomer selected from among vinyl monomers having functional groups reactive with the component (A). The use of this agent makes it possible to conduct the electrostatic coating of a styrene resin molding without applying any conductive primer, i.e., immediately after the completion of molding, and the film formed by the use of the agent is excellent in water resistance.

Inventors:
KAMIYAMA SHIRO (JP)
KOHAMA KATSUMI (JP)
MASUDA HISASHI (JP)
OKADA TAKEO (JP)
INADA EIJI (JP)
Application Number:
PCT/JP1998/000957
Publication Date:
September 16, 1999
Filing Date:
March 09, 1998
Export Citation:
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Assignee:
HONDA MOTOR CO LTD (JP)
SANYO CHEMICAL IND LTD (JP)
KAMIYAMA SHIRO (JP)
KOHAMA KATSUMI (JP)
MASUDA HISASHI (JP)
OKADA TAKEO (JP)
INADA EIJI (JP)
International Classes:
B05D1/04; B05D3/00; C08J7/04; C08L25/02; C08L25/04; C08L25/06; C08L25/18; C08L33/20; C08L57/00; C08L69/00; C08L77/00; C08L77/12; C09D5/46; C09D141/00; C09D177/12; C08L41/00; (IPC1-7): C08L25/04; B05D1/04
Foreign References:
JPH0848768A1996-02-20
JPH0812755A1996-01-16
JPS6395251A1988-04-26
JPS488322A1973-02-02
JPH0987494A1997-03-31
JPH08311331A1996-11-26
Other References:
See also references of EP 1008627A4
Attorney, Agent or Firm:
Ikeuchi, Hiroyuki (Umeda Plaza Building 3-25, Nishitenma 4-chome, Kita-k, Osaka-shi Osaka, JP)
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