Title:
AIR BONDING PROCESS
Document Type and Number:
WIPO Patent Application WO/2014/120813
Kind Code:
A8
Abstract:
Pressurized air is conveyed through a manifold into contact with the first member via apertures having hole diameters of from 0.8 to 2.5 mm that are spaced apart at a distance of from 10 to 30 mm along the manifold to achieve a turbulent air flow pattern with a Reynolds number of greater than 2200 at a temperature of between 150 and 315°C and at an air pressure between 0.5 and 10 pounds per square inch (psi) over ambient pressure onto the outer surfaces of the first member and the second member for heat curing a curable adhesive between the members to achieve adhesive cure in 60 to 90 seconds and free of any bond-line read-out visible to an unaided normal human eye.
Inventors:
GUHA PROBIR KUMAR (US)
HASKELL BRAD (US)
FORAN HUGH C (US)
HASKELL BRAD (US)
FORAN HUGH C (US)
Application Number:
PCT/US2014/013660
Publication Date:
March 26, 2015
Filing Date:
January 29, 2014
Export Citation:
Assignee:
CONTINENTAL STRUCTURAL PLASTICS INC (US)
International Classes:
C09J5/00
Attorney, Agent or Firm:
GOLDSTEIN, Avery, N. (450 N. Old Woodward AvenueFirst Floo, Birmingham MI, US)
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