Title:
AIR-GAP TYPE PIEZOELECTRIC BULK ACOUSTIC WAVE DEVICE HETEROGENEOUS INTEGRATION METHOD, AND DEVICE THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/163973
Kind Code:
A1
Abstract:
Provided is an air-gap type piezoelectric bulk acoustic wave device heterogeneous integration method, comprising: using a soft seal to lift a bulk acoustic wave device thin film (320) from a donor substrate; using the soft seal to place the bulk acoustic wave device on a middle layer (330) above a CMOS circuit (370), while also causing the bulk acoustic wave device to be located at a designated position of the middle layer, the designated position having a cavity (340) or the designated position having a support structure (5020) and a sacrificial layer (5030). Material transfer printing technology is used to transfer the transferable bulk acoustic wave device to a target system platform, ultimately forming a 3D stacked integrated structure, having the following advantages: lower cost, higher degree of integration, lower operating temperature requirement, and shorter operating time.
Inventors:
PANG WEI (CN)
GAO CHUANHAI (CN)
ZHANG MENGLUN (CN)
GAO CHUANHAI (CN)
ZHANG MENGLUN (CN)
Application Number:
PCT/CN2018/124074
Publication Date:
August 20, 2020
Filing Date:
February 15, 2019
Export Citation:
Assignee:
UNIV TIANJIN (CN)
ROFS MICROSYSTEM (TIANJIN) CO LTD (CN)
ROFS MICROSYSTEM (TIANJIN) CO LTD (CN)
International Classes:
H03H9/02; H01L21/336; H01L33/00; H03H3/02
Foreign References:
| CN105680813A | 2016-06-15 | |||
| CN105355563A | 2016-02-24 | |||
| CN102545827A | 2012-07-04 | |||
| CN104030234A | 2014-09-10 | |||
| CN107093994A | 2017-08-25 |
Attorney, Agent or Firm:
CHINA SMART INTELLECTUAL PROPERTY LTD. (CN)
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