Title:
AIRTIGHT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/139148
Kind Code:
A1
Abstract:
The present invention provides an airtight package comprising a package substrate and a glass lid which are sealed to each other in an airtight manner via a seal material layer, the airtight package being characterized in that: the package substrate includes a base portion and a frame portion provided on the base portion; the frame portion of the package substrate contains an internal element; the seal material layer is disposed between a top portion of the frame portion of the package substrate and the glass lid; and the seal material layer is formed in a position which is spaced apart from an inner edge of the top portion of the frame portion and which is spaced apart from an outer edge of the top portion of the frame portion.
Inventors:
SHIRAGAMI TORU (JP)
Application Number:
PCT/JP2017/046681
Publication Date:
August 02, 2018
Filing Date:
December 26, 2017
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
H01L23/02; H01L23/08
Domestic Patent References:
| WO2016136899A1 | 2016-09-01 |
Foreign References:
| JP2016027610A | 2016-02-18 | |||
| JP2006253243A | 2006-09-21 | |||
| JP2016086049A | 2016-05-19 |
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