Title:
AIRTIGHT SEALING CAP AND METHOD OF MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/066078
Kind Code:
A1
Abstract:
Provided is an airtight sealing cap with a flange portion, in which flow of solder outside a bonding region is suppressed. In the airtight sealing cap, which is used in an electronic component-accommodating package including an electronic component-accommodating member for accommodating an electronic component, a surface of a base material is covered with an Ni-layer, the base material including a cavity portion having a cavity configured of a bottom plate portion and a side plate portion, and a flange portion disposed in an annular shape surrounding the opening of the cavity. The flange portion of the cap is provided with a bonding region for bonding with the electronic component-accommodating member, wherein a solder portion composed of an Au-Sn-based solder is provided in the bonding region. The Ni-layer is exposed in regions of the cap other than the bonding region.
Inventors:
HASHIMOTO AKINORI (JP)
NAGATOMO KAZUYA (JP)
NAGATOMO KAZUYA (JP)
Application Number:
PCT/JP2019/014174
Publication Date:
April 02, 2020
Filing Date:
March 29, 2019
Export Citation:
Assignee:
HITACHI METALS LTD (JP)
International Classes:
H01L23/02; H03H3/02; H03H9/02
Domestic Patent References:
| WO2004070836A1 | 2004-08-19 |
Foreign References:
| JP2010153438A | 2010-07-08 | |||
| JP2004152750A | 2004-05-27 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
Download PDF:
Previous Patent: PHOSPHOR ELEMENT, METHOD FOR PRODUCING SAME, AND LIGHTING DEVICE
Next Patent: KNUCKLE GUARD
Next Patent: KNUCKLE GUARD