ALICYCLIC DIEPOXY COMPOUND, EPOXY RESIN COMPOSITION, AND CURED PRODUCT

Title:

ALICYCLIC DIEPOXY COMPOUND, EPOXY RESIN COMPOSITION, AND CURED PRODUCT

Document Type and Number:

WIPO Patent Application WO/2008/004504

Kind Code:

A1

Abstract:

Disclosed is an alicyclic diepoxy compound which enables to produce a cured article having no deterioration in physical properties even when used under high temperature/high humidity conditions, under conditions where a strong acid is produced or the like, which is excellent in reactivity during curing, and which enables to produce a cured article having excellent heat resistance. Specifically, disclosed is an alicyclic diepoxy compound which is a 3,4,3',4'-diepoxybicyclohexyl compound represented by the formula (1), wherein the 3,4,3',4'-diepoxybicyclohexyl compound contains its isomer at a percentage of less than 20% interms of a peak area of the isomer as determined by gas chromatography relative to the sum total of peak areas of the 3,4,3',4'-diepoxybicyclohexyl compound and the isomer. (1) wherein R1 to R18 independently represent a hydrogen atom, a halogen atom, a hydrocarbon group which may have an oxygen atom or a halogen atom, or an alkoxy group which may have a substituent.

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Inventors:

SATO ATSUSHI (JP)
TAKAI HIDEYUKI (JP)
MAESHIMA HISASHI (JP)
KITAO KYUHEI (JP)

Application Number:

PCT/JP2007/063109

Publication Date:

January 10, 2008

Filing Date:

June 29, 2007

Export Citation:

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Assignee:

DAICEL CHEM (JP)
SATO ATSUSHI (JP)
TAKAI HIDEYUKI (JP)
MAESHIMA HISASHI (JP)
KITAO KYUHEI (JP)

International Classes:

C07D303/04; C08G59/24

Domestic Patent References:

WO2004035558A1

2004-04-29

Foreign References:

JP2005097274A	2005-04-14
JP2004204228A	2004-07-22
JP2004099467A	2004-04-02
JP2000169399A	2000-06-20
JP2005097274A	2005-04-14
DE1418465A1	1968-10-03
JPS543006A	1979-01-11

Other References:

NEFTEKHIMIYA, vol. 12, 1972, pages 353
See also references of EP 2039692A4

Attorney, Agent or Firm:

GOTO, Yukihisa (2nd Floor 2-18, Kobai-cho,Kita-ku, Osaka-shi, Osaka 38, JP)

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