Title:
ALIGNMENT APPARATUS AND METHOD FOR WAFER BONDING
Document Type and Number:
WIPO Patent Application WO/2023/116157
Kind Code:
A1
Abstract:
The present application relates to an alignment apparatus and method for wafer bonding. In one embodiment of the present application, the alignment method for wafer bonding comprises: a microscope, which is used for focusing on a marker of a wafer; a multi-color light source, which is used for emitting light with a variable wavelength, so as to illuminate the marker of the wafer, wherein the light with the variable wavelength comprises light with a first wavelength and light with a second wavelength, the first wavelength being different from the second wavelength; and a camera, which is used for photographing the marker of the wafer when the multi-color light source performs illumination by means of the light of the first wavelength, so as to obtain a first picture, and photographing the marker of the wafer when the multi-color light source performs illumination by means of the light of the second wavelength, so as to obtain a second picture.
Inventors:
WANG CHEN (CN)
MA SHUANGYI (CN)
MA SHUANGYI (CN)
Application Number:
PCT/CN2022/126477
Publication Date:
June 29, 2023
Filing Date:
October 20, 2022
Export Citation:
Assignee:
PIOTECH HAINING SEMICONDUCTOR EQUIPMENT CO LTD (CN)
International Classes:
G02B21/06; H01L21/68
Foreign References:
| CN1534273A | 2004-10-06 | |||
| CN106291899A | 2017-01-04 | |||
| CN102540446A | 2012-07-04 | |||
| CN103727884A | 2014-04-16 | |||
| US20130169788A1 | 2013-07-04 |
Attorney, Agent or Firm:
LEE AND LI - LEAVEN IPR AGENCY LTD. (CN)
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