Title:
ALIGNMENT DEVICE AND ALIGNMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2024/075671
Kind Code:
A1
Abstract:
In the present invention, a joining device (1) comprises: a stage (401); a head (402); support members (4039) that support the stage (401) so as to enable the stage (401) to move in the horizontal direction with respect to the head (402); an air cylinder (4034) that biases the stage (401) in one direction; a linear actuator (4031) that adjusts the position of the stage (401) in one direction; distance-measuring units (521, 524) that are arranged around a table member (405) and that measure the distance to the table member (405); and a control unit (9) that controls the linear actuator (4031) such that after the positioning of substrates (W1, W2) has provisionally concluded, the distance at the time the positioning has provisionally concluded is kept uniform.
Inventors:
YAMAUCHI AKIRA (JP)
Application Number:
PCT/JP2023/035843
Publication Date:
April 11, 2024
Filing Date:
October 02, 2023
Export Citation:
Assignee:
BONDTECH CO LTD (JP)
International Classes:
H01L21/68; H01L21/603
Domestic Patent References:
| WO2014136143A1 | 2014-09-12 |
Foreign References:
| JP2014126414A | 2014-07-07 | |||
| JP2011119293A | 2011-06-16 | |||
| JP2008258368A | 2008-10-23 | |||
| JP2017162919A | 2017-09-14 | |||
| JP2012231063A | 2012-11-22 | |||
| JP2020184579A | 2020-11-12 |
Attorney, Agent or Firm:
RYOCHIKU Shiro (JP)
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