Title:
ALIGNMENT AND LAMINATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/034554
Kind Code:
A1
Abstract:
An alignment and lamination device, comprising a placement platform assembly (1), wherein the placement platform assembly comprises a carrying platform (10), and the carrying platform (10) can move in an X direction and a Y direction and can rotate; a lamination assembly (2), comprising a lamination Z-direction slider (21) arranged in a Z direction, a lamination slide rail (24) arranged on the lamination Z-direction slider (21), and a suction plate (25) arranged on the lamination slide rail (24); and a visual alignment assembly configured to align a second workpiece on the carrying platform (10) with a first workpiece on the suction plate (25).
More Like This:
Inventors:
HE JIANTENG (CN)
YE KUN (CN)
SHANG QIUFENG (CN)
YE KUN (CN)
SHANG QIUFENG (CN)
Application Number:
PCT/CN2018/125135
Publication Date:
February 20, 2020
Filing Date:
December 29, 2018
Export Citation:
Assignee:
KUNSHAN JINGXUN ELECTRONIC TECH CO LTD (CN)
International Classes:
G02F1/13; B32B37/10; B32B38/18
Foreign References:
CN108828807A | 2018-11-16 | |||
CN208689310U | 2019-04-02 | |||
CN203543283U | 2014-04-16 | |||
CN203543283U | 2014-04-16 | |||
CN106313847A | 2017-01-11 | |||
CN106028787A | 2016-10-12 | |||
CN104960953A | 2015-10-07 | |||
CN207497012U | 2018-06-15 | |||
CN104015454A | 2014-09-03 | |||
JP2016022605A | 2016-02-08 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
Download PDF:
Previous Patent: HIGH PRESSURE PUMP AND HIGH PRESSURE PUMPING METHOD
Next Patent: SOUND-EMITTING DEVICE AND ELECTRONIC DEVICE
Next Patent: SOUND-EMITTING DEVICE AND ELECTRONIC DEVICE