Title:
ALKALI DEVELOPING-TYPE PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/187904
Kind Code:
A1
Abstract:
[Problem] To provide an alkali developing-type photosensitive resin composition having excellent solvent solubility, resolution, sensitivity, and adhesiveness while maintaining high heat resistance. [Solution] This alkali developing-type photosensitive resin composition is characterized: in containing a carboxyl group-containing resin, a photobase generator, a thermosetting resin, and a filler; and in that the thermosetting resin contains a maleimide compound having a biphenyl skeleton, and the filler has a photoreacting or a thermoreacting functional group at the surface.
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Inventors:
SHIMADA SAWAKO (JP)
OKADA KAZUYA (JP)
KUDO TOMOYA (JP)
UETA CHIHO (JP)
OKADA KAZUYA (JP)
KUDO TOMOYA (JP)
UETA CHIHO (JP)
Application Number:
PCT/JP2019/007358
Publication Date:
October 03, 2019
Filing Date:
February 26, 2019
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
G03F7/027; C08F299/02; G03F7/004; G03F7/031; H05K3/28
Domestic Patent References:
| WO2013172434A1 | 2013-11-21 | |||
| WO2017122460A1 | 2017-07-20 |
Foreign References:
| JPH0673003A | 1994-03-15 | |||
| JP2011042711A | 2011-03-03 | |||
| JP2015196764A | 2015-11-09 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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