Title:
ALKENYL-GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2019/198606
Kind Code:
A1
Abstract:
An alkenyl-group-containing compound represented by formula (1).
(In formula (1), X represents any organic group; Y represents an alkenyl group, and when more than one Y is present, then the Y's may be the same or different; Z represents a hydrogen atom, a C1-15 hydrocarbon group, or a C1-15 alkoxy group, and when more than one Z is present, the Z's may be the same or different; l is a natural number of 1 to 6; and m and n are each an integer of 0 or larger and satisfy that m+n = 1 to 5, at least one of the l m's being 1 or larger.)
Inventors:
TOHJIMA TAKAYUKI (JP)
NAKANISHI MASATAKA (JP)
HASEGAWA ATSUHIKO (JP)
MATSUURA KAZUKI (JP)
NAKANISHI MASATAKA (JP)
HASEGAWA ATSUHIKO (JP)
MATSUURA KAZUKI (JP)
Application Number:
PCT/JP2019/014919
Publication Date:
October 17, 2019
Filing Date:
April 04, 2019
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F212/00; C07C43/205; C07C43/215; C07D251/34; C08F234/00
Foreign References:
| JPS62109810A | 1987-05-21 | |||
| JPS6377986A | 1988-04-08 | |||
| JPH01144410A | 1989-06-06 | |||
| JPH04330066A | 1992-11-18 | |||
| JPH04306244A | 1992-10-29 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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