ALLOY FOR SOLDER AND SOLDER JOINT

Title:

ALLOY FOR SOLDER AND SOLDER JOINT

Document Type and Number:

WIPO Patent Application WO/2002/034969

Kind Code:

A1

Abstract:

An alloy for solder having a chemical composition: Zn: 3.0 to 14.0 wt %, Al: 0.0020 to 0.0080 wt %, and balance: Sn and inevitable impurities; an alloy for solder having a chemical composition: Zn: 3.0 to 14.0 wt %, Bi: 3.0 to 6.0 wt %, Al: 0.0020 to 0.0100 wt %, and balance: Sn and inevitable impurities; and a solder joint in electric or electronic equipment which comprises the alloy for solder. The alloy for solder has no adverse effect on the environment and exhibits good solderability comparable to that of a conventional Pb-Sn solder.

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Inventors:

KITAJIMA MASAYUKI
SHONO TADAAKI
HONMA HITOSHI
TAKESUE MASAKAZU
NODA YUTAKA

Application Number:

PCT/JP2001/008399

Publication Date:

May 02, 2002

Filing Date:

September 26, 2001

Export Citation:

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Assignee:

FUJITSU LTD (JP)

International Classes:

B23K35/26; C22C13/00; C22C13/02; B23K35/24; (IPC1-7): C23K1/00; B23K35/26

Foreign References:

JP2000015478A	2000-01-18
JPH09206983A	1997-08-12
JPS6235876B2	1987-08-04
JPS5942197A	1984-03-08
US4042725A	1977-08-16
JP2001150179A	2001-06-05
JP2000326088A	2000-11-28

Other References: