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Title:
ALUMINA PARTICLES AND RESIN COMPOSITION USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/255226
Kind Code:
A1
Abstract:
Provided are alumina particles which are used as a filler for a resin composition and can improve the thermal conductivity of a resin composition further than before. In these alumina particles, the particle diameter D50 at cumulative 50% from the fine particle side of the cumulative particle size distribution is greater than 100 μm, the pregelatinization rate is at least 90%, and α-alumina is a single crystal. The alumina particles preferably have a Na content of at most 800 ppm. Moreover, the alumina particles preferably have a particle diameter D10 of 70-135 μm at cumulative 10% from the fine particle side of the cumulative particle size distribution.

Inventors:
NAKATA KUNIHIKO (JP)
ARISE ICHIRO (JP)
EGAWA TAKAMASA (JP)
SHIMAZAKI YASUHARU (JP)
DAIMON UEHARA MICHIRU (JP)
Application Number:
PCT/JP2022/021614
Publication Date:
December 08, 2022
Filing Date:
May 26, 2022
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C01F7/02; C01F7/022; C01F7/027; C08K3/22; C08L101/00
Domestic Patent References:
WO2008053536A12008-05-08
WO2020153505A12020-07-30
WO2009017170A12009-02-05
WO2020170307A12020-08-27
WO2009133904A12009-11-05
WO2008053536A12008-05-08
Foreign References:
JP2012067205A2012-04-05
JP2015078306A2015-04-23
JP2015166294A2015-09-24
JP2019167283A2019-10-03
JP2006169090A2006-06-29
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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