Title:
ALUMINUM ALLOY FIN MATERIAL FOR HEAT EXCHANGERS WHICH HAS EXCELLENT BUCKLING RESISTANCE, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/244411
Kind Code:
A1
Abstract:
An aluminum alloy fin material for heat exchangers which has high strength and excellent buckling resistance is provided as a fin material which has excellent moldability during a corrugation processing and also has proper pre-brazing strength suitable for easy molding into a fin even when the fin material is thinned so as to have a final thickness of 30 to 80 μm, and which exhibits proper self corrosion resistance and a proper sacrificial anode effect and can constitute a working fluid passage. The fin material contains, in % by mass, 1.3% to 1.6% of Si, 0.30% to 0.70% of Fe, 1.8% to 2.3% of Mn, 0.5% to 2.0% of Zn and 0.002% to 0.10% of Ti, also contains, as impurities, Mg in a limited amount of 0.05% or less and Cu in a limited amount of 0.06% or less, also contains a remainder made up by unavoidable impurities and Al, has a final thickness of 30 to 80 μm, tensile strength of 260 MPa or less and a solidus temperature of 615°C or higher, and also has tensile strength of 170 MPa or more and a spontaneous potential of -780 to -700 mV when measured after being brazing-heated and then cooled.
Inventors:
KOKUBO TAKANORI (JP)
ANAMI TOSHIYA (JP)
SHIMOSAKA DAISUKE (JP)
SHINODA TAKAHIRO (JP)
NAKASHITA KOICHI (JP)
YAMAMOTO TETSUYA (JP)
ANAMI TOSHIYA (JP)
SHIMOSAKA DAISUKE (JP)
SHINODA TAKAHIRO (JP)
NAKASHITA KOICHI (JP)
YAMAMOTO TETSUYA (JP)
Application Number:
PCT/JP2019/008060
Publication Date:
December 26, 2019
Filing Date:
March 01, 2019
Export Citation:
Assignee:
NIPPON LIGHT METAL CO (JP)
DENSO CORP (JP)
DENSO CORP (JP)
International Classes:
C22C21/00; F28F21/08; C22F1/04
Domestic Patent References:
WO2015141698A1 | 2015-09-24 | |||
WO2005075691A1 | 2005-08-18 | |||
WO2014034212A1 | 2014-03-06 |
Foreign References:
JPH0770685A | 1995-03-14 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Download PDF:
Previous Patent: COMMUNICATION SYSTEM, MASTER DEVICE, SLAVE DEVICE, AND COMMUNICATION METHOD
Next Patent: BATTERY MODULE AND BATTERY PACK
Next Patent: BATTERY MODULE AND BATTERY PACK