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Title:
ALUMINUM ALLOY WITH EXCELLENT HIGH-TEMPERATURE STRENGTH AND THERMAL CONDUCTIVITY, AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/008470
Kind Code:
A1
Abstract:
An aluminum alloy with excellent high-temperature strength and thermal conductivity, which is created both by adjusting the composition thereof so as to inhibit the deterioration of high -temperature strength and by minimizing the Mn content to reduce the amount of Mn solid-soluted in aluminum. An aluminum alloy having a composition which contains 12 to 16 mass% of Si, 0.1 to 2.5 mass% of Ni, 3 to 5 mass% of Cu, 0.3 to 1.2 mass% of Mg, 0.3 to 1.5 mass% of Fe, 0.004 to 0.02 mass% of P, 0 to 0.1 mass% of Mn, and, if necessary, at least one of 0.01 to 0.1 mass% of V, 0.01 to 0.6 mass% of Zr, 0.01 to 0.2 mass% of Cr and 0.01 to 0.2 mass% of Ti. The aluminum alloy can be produced by subjecting a molten aluminum alloy having a composition as described above to ultrasonic irradiation at a temperature equal to or exceeding the liquidus curve, and then casting the resulting alloy within 100 seconds after the completion of the ultrasonic irradiation.

Inventors:
XING JIE (JP)
YAMAMOTO IZUMI (JP)
ODA KAZUHIRO (JP)
ISHIDA YUTAKA (JP)
HORIKAWA HIROSHI (JP)
Application Number:
PCT/JP2011/065917
Publication Date:
January 19, 2012
Filing Date:
July 06, 2011
Export Citation:
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Assignee:
NIPPON LIGHT METAL CO (JP)
XING JIE (JP)
YAMAMOTO IZUMI (JP)
ODA KAZUHIRO (JP)
ISHIDA YUTAKA (JP)
HORIKAWA HIROSHI (JP)
International Classes:
C22C21/02; B22D21/04; B22D27/08; C22C1/02; C22F1/043; C22F3/02
Foreign References:
JP2002249840A2002-09-06
JPH0472033A1992-03-06
JP2008127665A2008-06-05
JPH10226840A1998-08-25
JP2007216239A2007-08-30
JP2004209487A2004-07-29
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
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Claims: