Title:
ALUMINUM NITRIDE FILLED THERMALLY CONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/099432
Kind Code:
A1
Abstract:
A composition contains: (a) curable silicone composition including: (i) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane with a viscosity of 30 to 400mPa*s; (ii) a SiH functional crosslinker; and (iii) a hydrosilylation catalyst; where the molar ratio of crosslinker SiH functionality to vinyl functionality is 0.5: 1 to 1: 1; (b) alkyl trialkoxysilane and/or a mono-trialkoxysiloxy terminated dimethylpolysiloxane treating agent; (c) filler mix containing: (i) 40 wt%or more of spherical and irregular shaped AlN particles, both having an average size of 30 micrometers or more, the spherical AlN fillers are 40-60 wt%of the weight of the AlN fillers; (ii) 25-35 wt%spherical Al 2O 3 particles with an average size of 1-5 micrometers; (iii) 10-15 wt%of additional thermally conductive filler with a 0.1-0.5 micrometer average size; and (iv) optionally, BN fillers having an average size greater than 20 micrometers; where filler mix is 90-97 wt%and wt%is relative to composition weight unless otherwise stated.
Inventors:
ZHENG YAN (CN)
BHAGWAGAR DORAB (US)
HANSEN DARREN (US)
WEI PENG (CN)
WU HAN GUANG (CN)
BHAGWAGAR DORAB (US)
HANSEN DARREN (US)
WEI PENG (CN)
WU HAN GUANG (CN)
Application Number:
PCT/CN2020/127668
Publication Date:
May 19, 2022
Filing Date:
November 10, 2020
Export Citation:
Assignee:
DOW SILICONES CORP (US)
ZHENG YAN (CN)
BHAGWAGAR DORAB (US)
HANSEN DARREN (US)
WEI PENG (CN)
WU HAN GUANG (CN)
ZHENG YAN (CN)
BHAGWAGAR DORAB (US)
HANSEN DARREN (US)
WEI PENG (CN)
WU HAN GUANG (CN)
International Classes:
C08L83/05; C08K3/22; C08K3/28; C08K3/38; C08L83/04; C09K5/14
Foreign References:
| CN110982277A | 2020-04-10 | |||
| CN106281206A | 2017-01-04 | |||
| US20160060462A1 | 2016-03-03 | |||
| US20190233612A1 | 2019-08-01 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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