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Patent Searching and Data


Title:
ANALYSIS DEVICE, PROVISION DEVICE, ASSESSMENT METHOD, PROVISION METHOD, ASSESSMENT PROGRAM, AND PROVISION PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/157518
Kind Code:
A1
Abstract:
An analysis device for assessing the state of a cutting edge in a cutting tool, the analysis device being provided with: a measurement information acquisition unit for acquiring measurement information, which is information relating to a measurement result from a sensor provided to the cutting tool; a cutting information acquisition unit for acquiring cutting information, which is information relating to the cutting blade and which includes consumption information indicating the consumption of the cutting blade; and an assessment unit for assessing the state of the cutting blade on the basis of the measurement information acquired by the measurement information acquisition unit and the cutting information acquired by the cutting information acquisition unit.

Inventors:
KURIYAMA HIROMITSU (JP)
Application Number:
PCT/JP2021/003511
Publication Date:
August 12, 2021
Filing Date:
February 01, 2021
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B23Q17/09
Domestic Patent References:
WO2019239606A12019-12-19
Foreign References:
JP2017205826A2017-11-24
JPH07314290A1995-12-05
JPH106184A1998-01-13
JPS62136345A1987-06-19
JPH06238548A1994-08-30
JPH03150602A1991-06-27
US20190030672A12019-01-31
JP2016049608A2016-04-11
JP2018086712A2018-06-07
Attorney, Agent or Firm:
ONEDEE IP PARTNERS (JP)
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