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Patent Searching and Data


Title:
ANISOTROPIC CONDUCTIVE ADHESIVE AND CONDUCTIVE FILM THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/124931
Kind Code:
A1
Abstract:
The present invention provides an anisotropic conductive adhesive and a conductive film thereof. The conductive adhesive uses a thermal-cured epoxy resin system as a base, and comprises the following components in percentage by mass: 10-40wt% of epoxy resin, 0.5-10wt% of thermal curing agent, 10-40wt% of film forming resin, 10-40wt% of rubber containing carboxyl or hydroxyl, 0.1-5wt% of silane-based coupling agent, 0.1-5wt% of antioxidant, 1-10wt% of conductive ball, and the balance being a solvent. The present invention provides an anisotropic conductive adhesive that has a fast reaction speed and a short curing time.

Inventors:
SUN ZUOBANG (CN)
ZHANG XIA (CN)
WANG HAIJUN (CN)
LEE YUNGJUI (CN)
Application Number:
PCT/CN2019/085780
Publication Date:
June 25, 2020
Filing Date:
May 07, 2019
Export Citation:
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Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
C09J163/00; C09J7/40; C09J9/02; C09J133/04; C09J171/12
Foreign References:
CN109666413A2019-04-23
CN104673111A2015-06-03
CN101429341A2009-05-13
CN101781540A2010-07-21
CN103184017A2013-07-03
US20130154093A12013-06-20
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
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