Title:
ANISOTROPIC CONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2007/040090
Kind Code:
A1
Abstract:
Disclosed is an anisotropic conductive adhesive containing an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler and conductive particles. By using a phenoxy resin having a glass transition temperature (Tg) of not less than 66˚C but not more than 100˚C, the anisotropic conductive adhesive can have excellent fluidity characteristics upon mounting, while exhibiting good conductive/insulating properties and adhesive properties. This anisotropic conductive adhesive hardly suffers changes in characteristics even when it is used under high temperature, high humidity conditions for a long time, and thus it is used for applications requiring high reliability.
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Inventors:
TOSHIOKA HIDEAKI
YAMAMOTO MASAMICHI
YAMAMOTO MASAMICHI
Application Number:
PCT/JP2006/319027
Publication Date:
April 12, 2007
Filing Date:
September 26, 2006
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
TOSHIOKA HIDEAKI
YAMAMOTO MASAMICHI
TOSHIOKA HIDEAKI
YAMAMOTO MASAMICHI
International Classes:
C09J163/00; C09J7/00; C09J171/10; H01B1/00; H01B1/20; H01B5/16; H01R11/01
Foreign References:
| JPH08315885A | 1996-11-29 | |||
| JP2002201449A | 2002-07-19 | |||
| JP2002201450A | 2002-07-19 | |||
| JP2002204052A | 2002-07-19 | |||
| JP2002203871A | 2002-07-19 | |||
| JP2004220916A | 2004-08-05 | |||
| JP2003253231A | 2003-09-10 | |||
| JP2004331728A | 2004-11-25 | |||
| JP2005290241A | 2005-10-20 | |||
| JPH08315885A | 1996-11-29 | |||
| JP2000204324A | 2000-07-25 |
Other References:
See also references of EP 1944346A4
Attorney, Agent or Firm:
NAKANO, Minoru et al. (1-3, Shimaya 1-chome, Konohana-k, Osaka-shi Osaka 24, JP)
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