ANISOTROPIC CONDUCTIVE ADHESIVE

Title:

ANISOTROPIC CONDUCTIVE ADHESIVE

Document Type and Number:

WIPO Patent Application WO/2015/141343

Kind Code:

A1

Abstract:

Provided is an anisotropic conductive adhesive which enables the achievement of excellent optical characteristics and excellent heat dissipation characteristics. This anisotropic conductive adhesive contains: conductive particles (31), each of which is obtained by forming a metal layer that is mainly composed of Ag on the outermost surface of a resin particle; solder particles (32) which have a smaller average particle diameter than the conductive particles; light-reflecting insulating particles which have a smaller average particle diameter than the solder particles; and a binder in which the conductive particles (31), the solder particles (32) and the light-reflecting insulating particles are dispersed. The conductive particles and the light-reflecting insulating particles efficiently reflect light, thereby improving the light extraction efficiency of an LED package. In addition, since terminals are solder bonded with each other by means of the solder particles (32) during compression bonding, the contact area between terminals facing each other is increased, thereby enabling the achievement of high heat dissipation characteristics.

Inventors:

NAMIKI HIDETSUGU (JP)
KANISAWA SHIYUKI (JP)
ISHIGAMI AKIRA (JP)
AOKI MASAHARU (JP)

Application Number:

PCT/JP2015/053957

Publication Date:

September 24, 2015

Filing Date:

February 13, 2015

Export Citation:

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Assignee:

DEXERIALS CORP (JP)

International Classes:

C09J201/00; C09J9/02; C09J11/04; H01B1/00; H01B1/22; H01B5/16; H01L21/60; H05K1/18; H05K3/32; H05K3/34

Domestic Patent References:

WO2011155348A1	2011-12-15
WO2013051708A1	2013-04-11

Foreign References:

JP2011057917A	2011-03-24
JPH03129607A	1991-06-03
JP2006108523A	2006-04-20

Other References: