Title:
ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/048088
Kind Code:
A1
Abstract:
Provided are an anisotropic conductive film, a connection structure, and a method for producing a connection structure, that, in the case of high-pressure mounting, suppress increases in the continuity resistance value, avoid the generation of gaps between the anisotropic conductive film and terminals, and enable the long-term retention of connection reliability. The anisotropic conductive film according to the present invention comprises (A) an epoxy resin, (B) an epoxy resin curing agent having a melting point of at least 60°C, (C) (meth)acrylate monomer, and (D) a radical polymerization initiator, and has a glass transition temperature of at least 85°C and a minimum melt viscosity of 20,000 Pa·s to 90,000 Pa·s.
Inventors:
SASAZAKI HIROKI (JP)
Application Number:
PCT/JP2023/025676
Publication Date:
March 07, 2024
Filing Date:
July 12, 2023
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J7/35; C09J4/06; C09J9/02; C09J11/04; C09J11/06; C09J163/00; C09J171/12; H01B5/16; H01R11/01
Foreign References:
| JP2021088645A | 2021-06-10 | |||
| JP2012072382A | 2012-04-12 | |||
| JP2021134262A | 2021-09-13 | |||
| JP2018090708A | 2018-06-14 |
Attorney, Agent or Firm:
TORANOMON INTELLECTUAL PROPERTY FIRM (JP)
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