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Title:
ANISOTROPIC ELECTROCONDUCTIVE ADHESIVE AND METHOD FOR MANUFACTURING CONNECTED STRUCTURE USING THE ANISOTROPIC ELECTROCONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2010/038753
Kind Code:
A1
Abstract:
Disclosed is an anisotropic electroconductive adhesive that,  even when a heating tool is contacted and pressed at a slow speed, can realize high electrical connection reliability.  The anisotropic electroconductive adhesive comprises an insulating adhesive component and electroconductive particles dispersed in the insulating adhesive component.  The insulating adhesive component comprises a radical polymerizable compound, a radical initiator, and a film forming resin.  The lowest melt viscosity of the anisotropic electroconductive adhesive is in the range of 100 to 800 Pa∙s, and the temperature at which the adhesive exhibits the lowest melt viscosity is in the range of 90 to 115°C.

Inventors:
SATO DAISUKE (JP)
HAYASHI SHINICHI (JP)
Application Number:
PCT/JP2009/066987
Publication Date:
April 08, 2010
Filing Date:
September 29, 2009
Export Citation:
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Assignee:
SONY CHEM & INF DEVICE CORP (JP)
SATO DAISUKE (JP)
HAYASHI SHINICHI (JP)
International Classes:
C09J201/00; C09J4/02; C09J5/06; C09J9/02; C09J109/00; C09J163/00; C09J171/12; C09J175/16; H01B1/22; H01R11/01; H01R43/00; H05K1/14; H05K3/36
Domestic Patent References:
WO2004050779A12004-06-17
WO2005121266A12005-12-22
Foreign References:
JP2001189108A2001-07-10
JP2005054140A2005-03-03
JP2005320455A2005-11-17
JP2005307169A2005-11-04
JP2005264109A2005-09-29
JPH11329069A1999-11-30
JP2000044895A2000-02-15
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
Patent business corporation Tajime international patent firm (JP)
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