Title:
ANISOTROPIC ELECTROCONDUCTIVE ADHESIVE AND PRODUCTION METHOD FOR CONNECTION BODY
Document Type and Number:
WIPO Patent Application WO/2018/180685
Kind Code:
A1
Abstract:
The present invention provides: an anisotropic electroconductive adhesive which improves the reaction rate at a light-shielding part and which is capable of achieving excellent conduction resistance; and a production method for a connection body. This anisotropic electroconductive adhesive comprises: a polymer; at least one type of cationic polymerizable composition selected from oxetane compounds and epoxy compounds having a functionality of 5 or less; a photocationic polymerization initiator; a thermal cationic polymerization initiator; and electroconductive particles, wherein the photocationic polymerization initiator is an onium salt having tetrakis(pentafluorophenyl)borate as the anion and has a post-photocuring minimum melt viscosity of 300-8000 Pa·s and attains the post-photocuring minimum melt viscosity at 50-100°C. Due to this configuration, the present invention is able to inhibit an excessive rise in minimum melt viscosity during preceding irradiation of light.
Inventors:
KAJITANI TAICHIRO (JP)
TOKUHISA KENJI (JP)
TOKUHISA KENJI (JP)
Application Number:
PCT/JP2018/010761
Publication Date:
October 04, 2018
Filing Date:
March 19, 2018
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J163/00; C09J7/00; C09J9/02; C09J11/06; C09J171/00; H01B1/20; H01L21/60; H01R11/01
Foreign References:
| JP2002097443A | 2002-04-02 | |||
| JP2009054377A | 2009-03-12 | |||
| JP2016171284A | 2016-09-23 | |||
| JP2015025082A | 2015-02-05 | |||
| JP2000501551A | 2000-02-08 | |||
| JP2016204454A | 2016-12-08 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
Download PDF: