Title:
ANTENNA DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/127899
Kind Code:
A1
Abstract:
This antenna device is obtained that enables higher heat dissipation than in the related art, without increasing the height of the antenna device. The antenna device comprises: an array antenna 2 having an antenna substrate 12 with a plurality of element antennas 10 mounted on one surface and an integrated circuit 11 mounted on the other surface; a power supply 3 having a power supply substrate 14 on which a power supply component 13 is mounted; a base portion 4 which supports the antenna substrate 12 on one surface to connect the integrated circuit 11 and supports the power supply substrate 14 on the other surface to connect the power supply component 13, and to which heat generated by the integrated circuit 11 and the power supply component 13 is transmitted; a mount 5 which supports the base portion 4, to which heat from the base portion 4 is transmitted, and which is fixed to a moving body 1; a radome 6 that houses the array antenna 2, the power supply 3, and the base portion 4, and is attached to the mount 5; and a skirt 7 that is provided on the outer peripheral surface of the mount 5 between the radome 6 and the moving body 1 to radiate heat transmitted from the mount 5.
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Inventors:
UEDA TARO (JP)
Application Number:
PCT/JP2022/048287
Publication Date:
July 06, 2023
Filing Date:
December 27, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01Q1/28; H01Q1/42; H05K7/20
Domestic Patent References:
| WO2021046527A1 | 2021-03-11 | |||
| WO2020261706A1 | 2020-12-30 | |||
| WO2020136861A1 | 2020-07-02 |
Attorney, Agent or Firm:
KURATANI, Yasutaka et al. (JP)
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