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Patent Searching and Data


Title:
ANTENNA MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/051649
Kind Code:
A1
Abstract:
This antenna module (101) is configured of a resin multilayer substrate that comprises a plurality of flexible base materials (11, 12, 13, 14). The resin multilayer substrate has a rigid part where a relatively large number of base materials are laminated and a flexible part where a relatively small number of base materials are laminated. A radiation element (1) that is composed of a conductor pattern is formed in the rigid part. A transmission line that is composed of a conductor pattern and is connected to the radiation element (1) is formed in the flexible part. A frame-like conductor (5) that surrounds the radiation element (1) when viewed from the lamination direction of the base materials is formed in one or both of the rigid part and the flexible part.

Inventors:
OGURI SHINYA (JP)
TAMURA WATARU (JP)
MATSUDA FUMIE (JP)
BABA TAKAHIRO (JP)
Application Number:
PCT/JP2016/074576
Publication Date:
March 30, 2017
Filing Date:
August 24, 2016
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P5/08; H01P3/08; H01Q1/50; H01Q13/08; H05K1/02
Domestic Patent References:
WO2011021677A12011-02-24
WO2012036139A12012-03-22
Foreign References:
JPH0983233A1997-03-28
JPH0383389A1991-04-09
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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