Title:
ANTIFOULING COATING MATERIAL COMPOSITION, ANTIFOULING COATING FILM, SUBSTRATE PROVIDED WITH ANTIFOULING COATING FILM, AND PRODUCTION METHODS THEREFOR, AND ANTIFOULING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/088377
Kind Code:
A1
Abstract:
Provided is an antifouling coating material composition which is used to obtain an antifouling coating film which can exhibit antifouling performance in a high-speed water flow environment for a long term, has excellent antifouling properties even on portions alternately being dry and wet, and excellent recoatability. Also, provided are an antifouling coating film using the antifouling coating material composition, a substrate provided with the antifouling coating film, and production methods therefor, and an antifouling method. The antifouling coating material composition is characterized by containing a silyl ester copolymer (A), the silyl ester copolymer (A) having (i) a structural unit derived from trialkyl silyl methacrylate (a1), and (ii) a structural unit derived from a compound (a2) represented by formula (I) (in formula (I), R1, R2, and R3 each independently represent a monovalent hydrocarbon group, each X independently represents a (meth)acryloyloxy alkyl group or a mercapto alkyl group, m and n are each independently 0 or more, p and q are each independently 0 or 1, and n+p+q is 1 or more).
Inventors:
TANINO SOICHIRO (JP)
IKADAI JUNNAI (JP)
HARADA SHOTARO (JP)
FUJIKI YUTAKA (JP)
IKADAI JUNNAI (JP)
HARADA SHOTARO (JP)
FUJIKI YUTAKA (JP)
Application Number:
PCT/JP2017/040020
Publication Date:
May 17, 2018
Filing Date:
November 07, 2017
Export Citation:
Assignee:
CHUGOKU MARINE PAINTS (JP)
International Classes:
C09D143/04; C09D5/16; C09D133/04; C09D183/04
Domestic Patent References:
WO2011046087A1 | 2011-04-21 | |||
WO2013073580A1 | 2013-05-23 | |||
WO2004007591A1 | 2004-01-22 | |||
WO2004081121A1 | 2004-09-23 |
Foreign References:
JP2016089167A | 2016-05-23 | |||
JP2006052284A | 2006-02-23 | |||
JP2006052283A | 2006-02-23 |
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (JP)
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