APPARATUS FOR ADHERING ANISOTROPIC CONDUCTIVE FILM

WIPO Patent Application WO/2010/053081

A1

Provided is an apparatus for adhering an anisotropic conductive film which can flexibly cope with substrates having various shapes and sizes, even the apparatus has a small main body size, and can reduce the tact time of an adhering step by adhering the anisotropic conductive films on a plurality of areas on the substrate at the same time.  The apparatus is provided with a tape supply section (P) which supplies an anisotropic conductive tape (T) wherein a separator and an anisotropic conductive film are laminated, and a tape pressure-adhering section (Q) which presses the separator side of the anisotropic conductive tape (T) and adheres only the anisotropic conductive film on a predetermined position on a work (W).  A plurality of pressure-adhering units (Qu1, Qu2) having adhering heads (1, 1') are arranged in the adhering direction of the anisotropic conductive film, and the interval between the adhering heads (1, 1') is adjustably set.  Tape supply units (Pu1, Pu2), each of which is provided with a reel mounting section wherein a reel (R) having the anisotropic conductive tape (T) wound thereon is mounted and held, are independently arranged for the adhering heads (1, 1'), respectively.

TSUDA TOYOHIKO (JP)
TEMBA TAKU (JP)
NISHIKAWA SHINICHI (JP)
GUO WEIHONG (JP)

PCT/JP2009/068803

May 14, 2010

November 04, 2009

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KYODO DESIGN & PLANNING CORP (JP)
TSUDA TOYOHIKO (JP)
TEMBA TAKU (JP)
NISHIKAWA SHINICHI (JP)
GUO WEIHONG (JP)

H05K3/32; H01L21/60; H05K3/36

JP2001168145A	2001-06-22
JP2007189197A	2007-07-26

SAITOH Yukihiko et al. (JP)
Masahiko Nishifuji (JP)

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