APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD

Title:

APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2011/090031

Kind Code:

A1

Abstract:

Disclosed is a solder powder adhering apparatus, which finely adheres a solder powder to an electronic circuit board. Also disclosed is a method for adhering the solder powder to the electronic circuit board. The apparatus for adhering the solder powder is provided with: a container, which contains the electronic circuit board and the solder powder; a substrate holding unit, which is provided in the container, and which holds the electronic circuit board such that the substrate surface faces substantially the vertical direction; a tilting mechanism, which has a tilted position where the container is tilted in the first direction as the initial position of the container, and tilts the container in the second direction, which is the direction opposite to the first direction, then, tilts the container again in the first direction; an eccentric motor, which vibrates the bottom portion of the container by rotating the rotating shaft, and which is provided at the center of the bottom portion; and a vibrating mechanism which is composed of a control means that sets the rotating shaft of the eccentric motor in the direction same as the tilting direction of the container.

Inventors:

SHOJI TAKASHI (JP)
SAKAI TAKEKAZU (JP)

Application Number:

PCT/JP2011/050769

Publication Date:

July 28, 2011

Filing Date:

January 18, 2011

Export Citation:

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Assignee:

SHOWA DENKO KK (JP)
SHOJI TAKASHI (JP)
SAKAI TAKEKAZU (JP)

International Classes:

H05K3/34; B23K3/06

Foreign References:

JP2006278650A	2006-10-12
JPH0774457A	1995-03-17
JP2010010270A	2010-01-14
JPH077244A	1995-01-10
JP2003332375A	2003-11-21
JP2006278650A	2006-10-12
JP2007149818A	2007-06-14

Other References: