Title:
APPARATUS FOR HEATING SHRINK FIT CHUCK
Document Type and Number:
WIPO Patent Application WO/2015/099259
Kind Code:
A1
Abstract:
The present invention provides an apparatus for heating a shrink fit chuck. The apparatus comprises: a case having a receiving part; a heating unit including a hollow part into which a shrink fit chuck is inserted and a heating coil for heating the shrink fit chuck, embedded in the receiving part and inserted into the hollow part, to thermally expand the same; and a cooling unit including a closed-loop type heat dissipation space formed on the inner peripheral surface of the hollow part and a fluid supply part for supplying cooling fluid into the heat dissipation space.
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Inventors:
PARK KWANG-OH (KR)
CHO BYOUNG-HOON (KR)
KANG KIL-SU (KR)
CHOI JAE-SEONG (KR)
CHO BYOUNG-HOON (KR)
KANG KIL-SU (KR)
CHOI JAE-SEONG (KR)
Application Number:
PCT/KR2014/007333
Publication Date:
July 02, 2015
Filing Date:
August 07, 2014
Export Citation:
Assignee:
DINE INC (KR)
International Classes:
B23B31/06; B23P11/00
Foreign References:
| JP2001287121A | 2001-10-16 | |||
| KR20040023064A | 2004-03-18 | |||
| JP2000343306A | 2000-12-12 | |||
| JP2003071670A | 2003-03-12 | |||
| KR20000047997A | 2000-07-25 |
Attorney, Agent or Firm:
JEON, SOO-JIN (KR)
전수진 (KR)
전수진 (KR)
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