Title:
APPARATUS AND METHOD FOR MANUFACTURING LED MODULE
Document Type and Number:
WIPO Patent Application WO/2019/017670
Kind Code:
A1
Abstract:
An apparatus and method capable of efficiently manufacturing a LED module. The method of manufacturing an Light Emitting Diode (LED) module includes preparing a substrate and a carrier on which an LED chip is disposed, disposing a mask on the substrate, the mask including an opening and a wall defining or forming the opening, picking up the LED chip from the carrier with a stamp, moving the LED chip picked up by the stamp to face the opening, moving the LED chip so that at least a part of the LED chip is inserted into the opening, and positioning the LED chip on the substrate by moving the LED chip so that the at least a part of the LED chip contacts the wall.
More Like This:
Inventors:
YOON JUNG-HOON (KR)
CHA KYUNG HOON (KR)
CHA KYUNG HOON (KR)
Application Number:
PCT/KR2018/008052
Publication Date:
January 24, 2019
Filing Date:
July 17, 2018
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H01L33/00; H01F7/06; H01L27/15
Foreign References:
| KR101754528B1 | 2017-07-06 | |||
| KR101672781B1 | 2016-11-07 | |||
| KR20160087264A | 2016-07-21 | |||
| US20130285086A1 | 2013-10-31 | |||
| US20150132873A1 | 2015-05-14 |
Attorney, Agent or Firm:
SELIM INTELLECTUAL PROPERTY LAW FIRM (KR)
Download PDF:
Previous Patent: HEADREST MOVING DEVICE
Next Patent: BATTERY SYSTEM FOR OFF-GRID POWER SUPPLY APPARATUS
Next Patent: BATTERY SYSTEM FOR OFF-GRID POWER SUPPLY APPARATUS