Title:
APPARATUS AND METHOD FOR MANUFACTURING A SWING-RING PLATE
Document Type and Number:
WIPO Patent Application WO/2012/026677
Kind Code:
A2
Abstract:
The present invention relates to an apparatus and method for manufacturing a swing-ring plate, and more particularly, to an apparatus for manufacturing a swing ring, comprising: a bending mechanism that moves a linear plate cut to a certain length from one end to the other, and bends the linear plate at either end thereof so as to bring the cross-sections thereof together and opposite one another in order to form a ring; a pre-bonding mechanism that fixes the bent plate in the ring shape and pre-bonds the ends in the horizontal and vertical directions; and a final bonding mechanism that completely bonds the pre-bonded part of the plate by revolving around the fixed pre-bonded plate and positioning so that the top and bottom surfaces of the pre-bonded plate face upward. According to the present invention, due to the fact that the swing-ring plate can be manufactured by bending a single plate, the traditional task of adjusting the smoothness of each part can be reduced, reducing work time and costs, and particularly, due to the lack of wasting raw materials, as occurs in the traditional processing of a unit plate that carries a certain curvature from a limited area, manufacturing costs can be further reduced, and smoothness can be readily adjusted to improve product reliability.
Inventors:
LEE SI HWA (KR)
Application Number:
PCT/KR2011/004727
Publication Date:
March 01, 2012
Filing Date:
June 29, 2011
Export Citation:
Assignee:
HANARO TECH CO LTD (KR)
LEE SI HWA (KR)
LEE SI HWA (KR)
International Classes:
B21D53/16; B21C51/00; B21D5/00; B23K31/02
Foreign References:
| KR20060048847A | 2006-05-18 | |||
| KR100858864B1 | 2008-09-17 | |||
| KR20100047144A | 2010-05-07 |
Attorney, Agent or Firm:
PATENT LAW FIRM GRAND KOREA (KR)
특허법인 대한 (KR)
특허법인 대한 (KR)
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Claims: