Title:
APPARATUS AND METHOD FOR OPTIMIZING CONTROL PARAMETER OF SOLDER PRINTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/242062
Kind Code:
A1
Abstract:
An electronic apparatus according to various embodiments of the present disclosure may comprise: a communication circuit which is communicatively connected to a solder printing apparatus configured to print solder on each of a plurality of substrates on the basis of a plurality of control parameters and a measurement apparatus configured to measure a state of the solder printed on each of the plurality of substrates; one or more memories; and one or more processors. One or more processors according to various embodiments may: obtain a first set of control parameters of the solder printing apparatus for printing solder on a first substrate; transmit information indicating the first set of control parameters; acquire first solder measurement information indicating the state of the solder printed on the first substrate; determine a first yield for the first substrate on the basis of the first solder measurement information; and generate a model for searching for an optimal control parameter set on the basis of a first data pair including the first control parameter set and the first yield.
Inventors:
HAN GUK (KR)
LEE JAE HWAN (KR)
LEE DUK YOUNG (KR)
PARK CHAN WOO (KR)
LEE JAE HWAN (KR)
LEE DUK YOUNG (KR)
PARK CHAN WOO (KR)
Application Number:
PCT/KR2021/006721
Publication Date:
December 02, 2021
Filing Date:
May 31, 2021
Export Citation:
Assignee:
KOH YOUNG TECH INC (KR)
International Classes:
G06F30/20; G06F115/12; G06F119/22
Domestic Patent References:
| WO2019208039A1 | 2019-10-31 |
Foreign References:
| KR20190102974A | 2019-09-04 | |||
| KR20170003296A | 2017-01-09 | |||
| US9419543B2 | 2016-08-16 | |||
| KR20130100266A | 2013-09-10 |
Other References:
See also references of EP 4068137A4
Attorney, Agent or Firm:
CHANG, Duck Soon et al. (KR)
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