Title:
APPARATUS AND METHOD FOR PRINTING PROCESS SIMULATION
Document Type and Number:
WIPO Patent Application WO/2011/155808
Kind Code:
A2
Abstract:
The present invention relates to an apparatus and a method for printing process simulation, and more particularly, to an apparatus and a method for printing process simulation which automatically investigate the adhesion characteristics among materials for a printing process and effects of process conditions on the adhesion characteristics. According to the present invention, adhesion characteristics among a stamp, ink, a base material and a substrate can be automatically calculated using a load sensor or the like.
Inventors:
KIM KWANG-SEOP (KR)
KIM JAE-HYUN (KR)
JANG BONG KYUN (KR)
LEE HAK-JOO (KR)
KIM JAE-HYUN (KR)
JANG BONG KYUN (KR)
LEE HAK-JOO (KR)
Application Number:
PCT/KR2011/004315
Publication Date:
December 15, 2011
Filing Date:
June 13, 2011
Export Citation:
Assignee:
KOREA MACH & MATERIALS INST (KR)
KIM KWANG-SEOP (KR)
KIM JAE-HYUN (KR)
JANG BONG KYUN (KR)
LEE HAK-JOO (KR)
KIM KWANG-SEOP (KR)
KIM JAE-HYUN (KR)
JANG BONG KYUN (KR)
LEE HAK-JOO (KR)
International Classes:
H01L21/027
Foreign References:
| KR20090109642A | 2009-10-21 | |||
| JP2010032993A | 2010-02-12 | |||
| JP2007183641A | 2007-07-19 | |||
| KR20070052505A | 2007-05-22 |
Attorney, Agent or Firm:
PANKOREA PATENT AND LAW FIRM (649-10 Yoksam-dong, Kangnam-ku, Seoul 135-080, KR)
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Claims: