APPARATUS AND METHOD FOR SOLDERING SIP MODULE TO CIRCUIT BOARD

WIPO Patent Application WO/2022/188522

A1

An apparatus for soldering a SIP module (3) to a circuit board (4), comprising a first frame (1) and a second frame (2). The first frame is provided a SIP module and the second frame. The side of the SIP module facing the first frame is provided with an interposer (31) and a plurality of electronic devices (32), wherein the plurality of electronic devices are all electrically connected to the interposer. The side of the first frame facing the SIP module is provided with relief grooves (11), wherein the relief grooves correspond to the positions of the electronic devices. The first frame is provided with through holes (12). A circuit board is provided on the first frame, and the interposer corresponds to the position of the circuit board. The second frame is provided with columns (21) corresponding to the through holes. The columns pass through the through holes and abut against the SIP module. The present invention further relates to a method for soldering a SIP module to a circuit board. The improvement of the apparatus for soldering a SIP module to a circuit board causes a process of soldering a SIP module to a circuit board more stable, ensures that an interposer and a circuit board can be fully soldered and fixed, and implements a stable electrical connection effect between a SIP module and a circuit board.

GAO LIN (CN)
WANG DEXIN (CN)
KE YUYANG (CN)

PCT/CN2021/143030

September 15, 2022

December 30, 2021

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QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD (CN)

B23K3/08; B23K37/02; B23K37/04

CN113118584A	2021-07-16
CN211102043U	2020-07-28
DE102012104220A1	2013-08-08
KR102145225B1	2020-08-18
CN212324452U	2021-01-08
CN107580425A	2018-01-12

BEYOND TALENT PATENT AGENT FIRM (CN)

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