Title:
APPARATUS AND METHOD FOR TEMPERATURE CONTROL DURING POLISHING
Document Type and Number:
WIPO Patent Application WO/2012/021215
Kind Code:
A3
Abstract:
Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.
Inventors:
CHEN HUNG CHIH (US)
HSU SAMUEL CHU-CHIANG (US)
DANDAVATE GAUTAM SHASHANK (US)
KOOSAU DENIS M (US)
HSU SAMUEL CHU-CHIANG (US)
DANDAVATE GAUTAM SHASHANK (US)
KOOSAU DENIS M (US)
Application Number:
PCT/US2011/040630
Publication Date:
April 12, 2012
Filing Date:
June 16, 2011
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
CHEN HUNG CHIH (US)
HSU SAMUEL CHU-CHIANG (US)
DANDAVATE GAUTAM SHASHANK (US)
KOOSAU DENIS M (US)
CHEN HUNG CHIH (US)
HSU SAMUEL CHU-CHIANG (US)
DANDAVATE GAUTAM SHASHANK (US)
KOOSAU DENIS M (US)
International Classes:
H01L21/304
Foreign References:
| US6077151A | 2000-06-20 | |||
| US7335088B1 | 2008-02-26 | |||
| JPH0957611A | 1997-03-04 | |||
| KR20020020717A | 2002-03-15 |
Attorney, Agent or Firm:
PATTERSON, B. Todd et al. (L.L.P.3040 Post Oak Blvd., Suite 150, Houston Texas, US)
Download PDF:
Previous Patent: METHOD OF IMPROVING PLANT GROWTH BY REDUCING FUNGAL INFECTIONS
Next Patent: FOLDING STACK IMPROVEMENTS
Next Patent: FOLDING STACK IMPROVEMENTS