CUTTING, DRILLING, AND FORMING

This application is being filed as a PCT International Patent application on December 4, 2013 in the name of Ikonics Corporation, a U.S. national corporation, applicant for the designation of all countries and Karl Shaw, a U.S. Citizen, Bret Walczynski, a U.S. Citizen, and Scott Welty, inventors for the designation of all countries, and claims priority to U.S. Provisional Patent Application No. 61/733,332, filed December 4, 2012, and U.S. Provisional Patent Application No. 61/886,649, filed October 3, 2013, the contents of which are herein incorporated by reference in their entireties.

Field of the Invention

The present invention is directed to apparatuses and methods for abrasive cutting, drilling, and forming of substrate materials, including composites and ceramics.

Back2round

Many materials, such as composite fiber constructions and ceramic compositions, have been developed for performing demanding tasks in extreme environments. For example, composite materials comprising fibers and hardened resins are well suited to tasks where high strength and low weight are highly desirable, such as in structural components for aircraft.

Despite their advantages in strength and weight, many such materials can be a challenge to drill and shape, such as to form holes for securing to one another or to other elements using fasteners. Traditional techniques of securing materials together with fasteners such as rivets, screws, nuts and bolts require that a fastener be inserted through or into the composite material, often necessitating that a hole be formed in the composite material. However, drilling of precise holes in a composite can often be difficult. Composite materials typically have different coefficients of expansion relative to metal drill bits, and therefore can be damaged by the expansion of a heated bit. Also, the twisting, cutting forces applied by a drill bit can be such that micro cracks are created in the composite material, which can later expand when the composite piece subjected to high load forces. These cracks can jeopardize the integrity of the composite material and the structure or article in which they are used. Furthermore, it can be particularly difficult to form non-circular holes in a composite material, such as a square or triangle. This is particularly true when the non-circular holes are small. Traditional machining processes utilizing rotating cutters are unable to adequately form small non-circular holes.

Other advanced materials, such as ceramics, are similarly difficult to process using conventional techniques. The relatively brittle nature of ceramic materials contributes to this difficulty in forming complex shapes, holes, depressions, and cuts. For example, it can be difficult to drill a precise hole in a ceramic material without also compromising the integrity of the ceramic. In addition, it can be very difficult to form non-circular openings in a ceramic material, such as squares, and it can be difficult to make non-linear cuts in ceramic materials, especially cuts with complex curves.

Therefore a need exists for improvements in the manner in which various substrate materials, such as composite materials and ceramics, can be modified to including various types and shapes of openings, depressions, edges, and other structural elements.

Summary of the Invention

The present invention is directed to methods of forming an opening in a substrate, such as a round hole, a square hole, or various other shapes, and for making cuts in various substrates; as well as apparatuses and equipment for forming openings, depressions, and cuts in substrates.

The methods allow for formation of holes that have substantially

perpendicular sidewalls relative to the surface in which the holes are formed. In the alternative, the methods allow for formation of holes with sidewalls of selected angles, such as greater or less than 90 degrees relative to the surface.

The methods further include the ability to cut a substrate, such as a piece of glass, ceramic, or composite material so that it has a clean, substantially perpendicular (or other selected angle) edge. The methods also allow for complex shapes to be cut, such as curves, bends, and angles in a wide variety of substrates, including composites, ceramics, and glass.

In typical embodiments the methods of the invention include directing a plurality of small abrasive-delivering nozzles at a surface to be modified. The surface is typically partially masked with a resist material that selectively protects portions of the surface from abrasives, while allowing other areas to be abraded. The direction and location of each nozzle is selected to provide desired cutting performance. When creating an opening or depression, such as a hole in the substrate, the nozzles are generally directed to provide relatively high flux volumes to the edges of the desired opening or depression that is being formed in the substrate. Thus, the nozzles are directed so that they cut away at the edge of the hole or depression, thereby avoiding formation of a tapered hole when not desired. Not only is the volume of flux high at these edges, the angle of the flux is such that it is directed to preferentially remove substrate material found at the edge of the mask.

The invention is also directed to apparatuses for forming depressions and holes in substrate materials, as well as to cut the substrates. The apparatuses include a plurality of nozzles arranged to form controlled depressions and holes in a substrate. Typically the plurality of nozzles is arranged to have a controlled flux of abrasive particles that selectively removes substrate material in a manner to provide controlled edge properties of the processed substrate. For example, the plurality of nozzles can be arranged to provide for substantially perpendicular edges of holes or edges cut in a substrate. The plurality of nozzles are often arranged so as to rotate around a central axis.

The above summary of the present invention is not intended to describe each disclosed embodiment of the present invention. This is the purpose of the detailed description that follows.

Figures

The invention will be more fully explained with reference to the following drawings, in which:

Figure 1 shows a flux distribution of an abrasive etching tool.

Figure 2A shows a cross section of a substrate containing a mask.

Figure 2B shows a cross section of partially abraded substrate and mask. Figure 3 shows a cross section of a substrate with a hole abraded through the substrate, shortly after the hole is initially formed.

Figure 4 shows a cross section of a substrate with a hole abraded through the substrate, the hole having inclined sidewalls.

Figure 5 shows a cross section of a substrate with a hole abraded through the substrate, the hole having inclined sidewalls, with a fastener inserted into the hole.

Figure 6 shows a schematic representation of a nozzle configuration of an apparatus constructed and arranged in accordance with an implementation of the invention.

Figure 7 shows a top plan representation of a rotating nozzle configuration of an apparatus constructed and arranged in accordance with an implementation of the invention.

Figure 8 shows a cross section of a substrate with a hole abraded through the substrate, shortly after the hole is starting to be formed.

Figure 9 shows a cross section of a substrate with a hole abraded through the substrate, the hole having perpendicular sidewalls.

Figure 10 shows a cross section of a substrate with a hole abraded through the substrate, the hole having perpendicular sidewalls, with a fastener inserted into the hole.

Figure 11 shows a nozzle configuration of an apparatus constructed and arranged in accordance with an implementation of the invention, showing primarily axial flow of the abrasive.

Figure 12 shows a nozzle configuration of an apparatus constructed and arranged in accordance with an implementation of the invention, showing dispersed abrasive flow

Figure 13 shows a nozzle configuration of an apparatus constructed and arranged in accordance with an implementation of the invention, focused abrasive flow.

Figure 14 shows a nozzle configuration of an apparatus constructed and arranged in accordance with an implementation of the invention, showing individual nozzles with controllers to independently adjust abrasive flow.

Figure 15 shows a nozzle configuration of an apparatus constructed and arranged in accordance with an implementation of the invention, showing individual nozzles with adjustable flow angles.

While principles of the invention are amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the disclosure.

Detailed Description

The present invention is directed to methods and apparatuses for forming an opening or depression in a substrate, such as a round hole, a square hole, or various other shapes of openings and depressions; as well as methods and apparatuses for cutting substrates. The methods and apparatuses allow for formation of holes that have substantially perpendicular sidewalls relative to the surface in which the holes are formed. In the alternative the methods allow for formation of holes and depressions with sidewalls of selected angles, such as greater or less than 90 degrees relative to the sidewall.

The methods and apparatuses further include the ability to cut a substrate, such as a piece of glass, ceramic, or composite material such that it has a clean, substantially perpendicular (or other selected angle) edge. In typical embodiments the methods of the invention comprise directing a plurality of small abrasive-delivering nozzles at a surface to be modified. The nozzles are directed so that they cut away at the edge of the hole or depression, thereby avoiding formation of a tapered hole.

The present invention is directed to equipment and methods for forming openings and depressions in substrates, such as a round hole, a square hole, or various other shapes; and for making cuts in various substrates. The methods allow for formation of holes that have substantially perpendicular sidewalls relative to the surface in which the holes are formed. In the alternative, the methods allow for formation of holes with sidewalls of selected angles, such as greater or less than 90 degrees relative to the surface.

The equipment and methods further include the ability to cut substrates, such as a piece of glass, ceramic, or composite material so that it has a clean, substantially perpendicular (or other selected angle) edge. The equipment and methods also allow for complex shapes to be cut, such as curves, bends, and angles in a wide variety of substrates, including composites, ceramics, and glass. The shapes and cuts can be formed with minimal damage to surrounding substrate material, which is a particularly significant benefit when cutting composite materials.

In typical embodiments the equipment and methods of the invention include directing a plurality of small abrasive-delivering nozzles at a surface to be modified. The surface is typically partially masked with a resist material that selectively protects portions of the surface from abrasives, while allowing other areas to be abraded. The direction and location of each nozzle is selected to provide desired cutting performance.

When creating an opening or depression, such as a hole in the substrate, the nozzles are generally directed to provide relatively high flux volumes to the edges of the desired opening or depression that is being formed in the substrate. Thus, the nozzles are directed so that they cut away at the edge of the hole or depression, thereby avoiding formation of a tapered hole when not desired. Not only is the volume of flux high at these edges, the angle of the flux is such that it is directed to preferentially remove substrate material found at the edge of the mask.

In some embodiments the apparatuses include a plurality of nozzles arranged to form controlled depressions and holes in a substrate. Typically the plurality of nozzles is arranged to have a controlled flux of abrasive particles that selectively removes substrate material in a manner to provide controlled edge properties of the processed substrate. For example, the plurality of nozzles can be arranged to provide for substantially perpendicular edges of holes or edges cut in a substrate. The plurality of nozzles are often arranged so as to rotate around a central axis.

A single nozzle construction, using a very narrow abrasive pattern at high speeds provides unique features and quality.

In the alternative, in some implementations multiple nozzles rotate together around a central axis. Optionally the system uses multiple nozzles at multiple angles with averaging features to provide desired cutting properties, such as straight sidewalls. Multiple nozzles with on-axis and off-axis combinations can provide desirable cutting properties.

Referring now to the drawings, Figure 1 shows a flux distribution of a nozzle for an example abrasive etching tool. The flux distribution is shown maximized at angle alpha, with a diminishment of the flux as distances from the center increase along radius r. Different nozzles will have slightly different flux distributions, but generally will have a higher central flux that diminishes away from this central axis. The flux generally correlates with the abrasive power of a nozzle. Thus, a nozzle will typically have its greatest cutting potential where the flux is highest. However, as will be described below, the actual cutting will vary along with other factors, such as the angle of the nozzles, the number of nozzles, etc.

Referring now to Figures 2 A and 2B, a cross section is shown of a substrate into which a depression has been cut using conventional abrasive blasting techniques. Figure 2A shows the substrate before the depression has been created, and Figure 2B shows the substrate after the depression has been created. In Figure 2A the substrate 200 includes a mask 210, such as a photosensitive film. The mask 210 includes an open area 220 surrounded by a resist area 230. In some implementations the open area 220 initially starts as an easily abraded area of the mask, rather than as an actual opening.

Upon using conventional abrasion techniques, a depression 240 can be formed in the substrate 200, as shown in Figure 2B. Arrows show the approximate vectors for particles delivered to the substrate from an abrasive delivery nozzle moved back and forth over the substrate 200. Even when the abrasive is applied relatively uniformly to the substrate 200, typically a relatively uneven depression 240 will be formed, with a deeper center 250 and more shallow sidewalls 260. This is particularly true when the depression 240 is relatively narrow. Thus, using conventional techniques, it can be particularly difficult to obtain uniform depths of depressions.

As a depression in a thick substrate gets deeper, it eventually breaks through the bottom of the substrate, as shown in Figure 3. In Figure 3, the substrate 300 has a depression 340 that has breached the bottom 360 of the substrate 300. Upon breakthrough of the bottom 360 of the substrate, the abrasive particle flux begins to travel toward the opening 370 because air will escape through the opening 370, and the particles tend to flow along the delivery airstream. The result is that after the bottom 360 of the substrate 300 has been pierced, it becomes even more difficult to avoid inclined sidewalls 380.

Thus, typically holes formed using an abrasive tool will often result in inclined sidewalls as shown in Figure 4, which shows substrate 400 with opening 440 having sidewalls 480 that are not perpendicular to the top surface of the substrate, and which have a variable diameter along the length of the opening. Such inclined sidewalls and uneven diameter are problematic because they do not allow for proper placement of a straight- walled fastener (such as a bolt or pin) into the opening.

As shown in Figure 5, a typical straight pin 515 will not fit properly in a hole 540 in a substrate 500 if the hole 540 has inclined walls. The hole and pin will have both a gap 570 and a small contact region 580. The gap 570 does not transfer load to the substrate, and the contact region 580 bears most of the load force, resulting in an inferior joint that is more likely to degrade or fail.

The present invention allows for forming of straight-walled holes and cuts by selective administration of abrasive flux in a manner that forms straight sidewalls by directing additional flux at inclined angles to the sidewalls of the hole that is being cut. In an example embodiment, Figure 6 shows a diagram of an apparatus 600 with three abrasive delivery nozzles 610A, 610B, and 610C. The nozzles 610A, 610B, 6 IOC are configured to rotate around axis Z. In the depicted embodiment, the nozzles 610A, 610B, 6 IOC are arranged to provide a hole in the substrate 620 that has substantially perpendicular side walls 630 and a relatively flat bottom 640. The relatively perpendicular side walls 630 are created by orienting the flux from the nozzles 610A, 610B, and 6 IOC such that flux is delivered to the sidewall with sufficient energy to abrade the substrate beneath the edge 650 of the mask 660 while avoiding premature breakthrough at the bottom of the hole.

This is accomplished, for example, by having at least one of the nozzles 610A arranged at an angle so that it is not perpendicular to the top surface of the substrate. In the depicted embodiment, nozzle 61 OA is shown arranged so that flux is delivered primarily along axis 612A, which crosses the rotational Z-axis. In this manner the abrasive flux from nozzle 61 OA provide a cutting force along the side walls of the hole to form substantially perpendicular sidewalls without premature breakthrough at the bottom of the hole. Often the nozzles will also move together up and down along an axis perpendicular to the surface of the substrate, thereby promoting relatively deep, uniform cuts, even with relatively narrow holes.

Figure 7 shows an alternative device 700 for abrading a hole through a substrate, the device containing 12 abrasive delivery nozzles 71 OA to 710L configured to rotate around an axis. The abrasive delivery nozzles are constructed such that the abrasive is directed, at least in part, to pass from the center of the hole toward the edge of the hole defined by a mask on the hole. This pathway to the edges of the mask creates a flux that cuts down in a perpendicular line below the edge of the mask. Often the nozzles will also move together up and down along an axis perpendicular to the surface of the substrate, thereby promoting relatively deep, uniform cuts, even with relatively narrow holes.

Figure 8 shows a cross section of a substrate 800 twith a hole being abraded through the substrate, shortly after the hole is starting to be formed. The substrate 800 includes a mask 810, such a s a photosensitive film. The mask 810 includes an open area 820 that initially starts as an easily abraded area of the mask, rather than as an actual opening. Using abrasive application techniques of the present invention, a depression 830 can be formed in the substrate 800, as shown in Figure 8. Arrows show simplified example vectors for particles delivered to the substrate 800, showing how the abrasive is delivered in a fashion to create a perpendicular cut into the substrate 800.

Figure 9 shows a cross section of a substrate with a hole abraded through the substrate 800 of Figure 8, with the hole having perpendicular (or substantially perpendicular) sidewalls 850. Figure 10 shows a cross section of the substrate 800 with a hole abraded through the substrate, the hole having perpendicular sidewalls 840, with a fastener 815 inserted into the hole 830.

Figure 11 A and 1 IB show a nozzle configuration of an apparatus 1100 constructed and arranged in accordance with an implementation of the invention, showing primarily axial flow of the abrasive. Figure 11 A shows the apparatus 1100 from an end view, with four nozzles 1110 on a rotating body 1110, with Figure 1 IB showing the apparatus 1100 from a side view.

Figure 12A and 12B show a nozzle configuration 1200 of an apparatus constructed and arranged in accordance with an implementation of the invention, showing dispersed abrasive flow. Figure 12A shows the apparatus 1200 from an end view, with four nozzles 1210 on a rotating body 1210, with Figure 12B showing the apparatus 1200 from a side view.

Figure 13A and Figure 13B show a nozzle configuration of an apparatus 1300 constructed and arranged in accordance with an implementation of the invention. Figure 13A shows the apparatus 1300 from an end view, with four nozzles 1310 on a rotating body 1310, with Figure 13B showing the apparatus 1300 from a side view.

Figure 14 shows a nozzle configuration of an apparatus 1400 constructed and arranged in accordance with an implementation of the invention, showing individual nozzles 1420 with controllers 1450 to independently adjust abrasive flow. The controllers can be, for example, air valves for turning flow of abrasive-carrying grit on and off. Other means for turning on and off air flow can also be used so as to dynamically control flow, either automatically or in response to observations of cutting performance.

Figure 15 shows a nozzle configuration of an apparatus 1500 constructed and arranged in accordance with an implementation of the invention, showing individual nozzles 1510 with adjustable flow angles, the nozzels on rotating assembly 1520. These flow angles can be adjusted manually or automatically, such as in advance of performing an abrasive cutting or etching process, or dynamically during the cutting process (such as when a hole or cut gets deeper).

It will be understood, as well, that in some implementations a single nozzle is used, rather than multiple nozzles, in which case the nozzle is typically controlled to provide the flux described above for the multiple nozzles, such as by a combination of rotation and tilting of nozzle.

The invention is also directed to apparatus for forming depressions and holes in substrate materials. The apparatus comprising a plurality of nozzles arranged to form controlled depressions and holes in a substrate.