APPARATUS AND METHODS FOR COMBINING CAMERA AND PROJECTOR

FUNCTIONS IN A SINGLE DEVICE

Disclosed embodiments relate to handheld devices, and more particularly to combining image capture and image projection functions within a single device. BACKGROUND

Small, handheld electronic devices such as personal digital assistants (PDAs) and cell phones have incorporated still and/or video camera capabilities, and the trend is expanding. However, these devices have limited display capabilities because of their small size. Consequently, the small display size limits a user's ability to view or share pictures and/or videos with others. SUMMARY

New and efficient light sources such as light emitting diodes (LEDs) have made it possible to construct very small projectors with digital light processing (DLP ^T ) technology that can project images that are large enough and bright enough for small groups of people to share. Combining image projection and image capture functions in very small handheld devices will thereby overcome the direct- view display size limitation, and allow users to make small group presentations or put on family slideshows or videos.

Described are handheld devices with combined image capture and image projection functions. The disclosed handheld devices are operable to both project and capture images, thereby overcoming the direct-view display size limitation. One embodiment of the handheld device includes a light source projecting a light beam along a first optic path and being modulated along a second optic path by a reflective light modulator. An image sensor may then capture an image reflected from the second optic path back along the first optic path by the reflective light modulator. In another embodiment, the reflective light modulator and the image sensor may be situated on a mechanical structure that is operable to switch between providing the reflective light modulator for image projection and providing the image sensor for image capture. In yet another embodiment, the reflective light modulator and the image sensor may be formed on the same semiconductor substrate, with the image sensor operable to capture an image reflected from multiple optic paths by the reflective light modulator.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram of an optical projection system; and

FIG. 2 is a diagram of an optical projection/camera system with a disclosed image sensor embodiment;

FIGS. 3A-3B are diagrams of an optical projection/camera system with a disclosed mirror/prism embodiment;

FIGS. 4A-4B are diagrams of an optical projection/camera system with a disclosed mechanical structure embodiment;

FIGS. 5A-5B are diagrams of an optical projection/camera system with a disclosed circular turret-like structure embodiment;

FIGS. 6A-6B are diagrams of an optical projection/camera system with another disclosed mechanical_stracture embodiment;

FIGS. 7A-7B are diagrams of an optical projection/camera system with a disclosed support structure embodiment;

FIGS. 8A-8B are diagrams of an optical projection/camera system with a disclosed projection/imaging lens embodiment;

FIG. 9 is a diagram of an optical projection/camera system with a disclosed dual lens embodiment;

FIG. 1OA illustrates a top-down view of a 3x3 array of digital micromirror device cells; and

FIG. 1OB is a diagram of an optical projection/camera system with a disclosed integrated image sensor embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

FIG. 1 is a diagram of the various devices and components of an optical projection system 100 generally starting with a light source 102, such as light emitting diodes (LEDs) or lasers. The beams of light from the light source 102 are processed by optical devices 104, including but not limited to color separation elements such as color filters and color wheels, optics such as condensing, shaping, and relay lenses, and integrating elements such as an integrator. These optical devices 104 may substantially align, shape, configure, filter, or orient the beams of light. The processed light is then modulated by a spatial light modulator (SLM) 106 such as a digital micromirror device (DMD). The features and functions of

SLMs and DMDs are further described in a commonly owned U.S. Patent No. 6,038,056 entitled "Spatial light modulator having improved contrast ratio," Ser. No. 09/354,838, filed JuI. 16, 1999, which is incorporated herein by reference in its entirety for all purposes. The SLM or DMD 106 substantially modulates and aligns the light before it is focused and projected by projection optics 108 onto an image plane such as a screen 110.

FIG. 2 illustrates a disclosed embodiment integrating an image-capturing device such as a charge-coupled device (CCD) image sensor 112 within an optical projection system 100. A complementary metal oxide semiconductor (CMOS) image sensor 112 may also be used. Both the CCD and the CMOS image sensors 112 digitally capture images by converting light into electric charge and processing the charge into electronic signals. The electronic signals may then be stored on an image processing electronics (not shown). Additionally, the image processing electronics (not shown) of the image sensor 112 may be integrated with the processing electronics of the DLP chip 106. As illustrated, the CCD image sensor 112 resides within an optic path of the optical devices 104 between the light source 102 and the DMD 106. In image capture or camera mode, an incoming image 114 may be collected by the projection optics 108 and focused upon the DMD 106. The projection lens 108 is acting like a camera lens 108 whereby the lens 108 may refocus or shift as necessary to capture the image 114 at an optimal focal length 116.

Because of the DMD's 106 mirror-like surface, the incoming image 114 maybe reflected toward the same optic path as that of the optical devices 104 and the CCD image sensor 112. The CCD image sensor 112 records and stores the incoming image 114 as it reflects off the DMD 106 and into the common optic path. One of the benefits of the disclosed embodiment is that alternating between projection mode and camera mode may be accomplished by sliding the CCD image sensor 112 into or out of the optic path of the optical devices 104. In this and in subsequent described embodiments, a mechanical actuator such as a motor, a relay, or other electromechanical devices may be provided to meet the mechanical movements. Additional advantages include the ability to match the size and resolution of the CCD image sensor 112 with the DMD 106 by matching the magnification between image projection and image capture. In another embodiment, depending on whether the DMD 106 mirrors are turned to the "on-state" or the "off-state," the incoming image 114 may be directed to an alternate optic path 118.

FIGS. 3A-3B illustrate another embodiment in which a CCD image sensor 112 is incorporated within an optical projection system. As illustrated, the CCD image sensor 112 is situated at 90 degrees relative to the DMD 106. A single mirror or prism 120 may be positioned parallel with and in front of the CCD image sensor 112. The single mirror or prism 120 actuates to one of two positions. In FIG. 3 A projection mode 122, the single mirror 120 remains parallel with the CCD image sensor 112 thereby allowing light from the DMD 106 to be focused by the projection lens 108 and projected out onto a screen 110. In FIG. 3 B camera mode 124, however, the single mirror 120 extends or flips out into the optic path between the DMD 106 and the camera lens 108. As a result, an incoming image 114 may be focused by the camera lens 108, reflected by the single mirror or prism 120, and captured by the CCD image sensor 112.

FIGS. 4A-4B illustrate another embodiment whereby a CCD image sensor 112 can slide into position depending on the mode of operation. As illustrated, a CCD image sensor 112 may be positioned parallel with and in front of the DMD 106. In FIG. 4A projection mode 122, the CCD image sensor 112 resides off the optic path thereby allowing light from the DMD 106 to be focused by the projection lens 108 and projected out onto a screen 110. In FIG. 4B camera mode 124, however, the CCD image sensor 112 rotates or translates into the optic path between the DMD 106 and the camera lens 108. As a result, an incoming image 114 is focused by the camera lens 108 and captured by the CCD image sensor 112. The lens 108 may automatically or manually refocus to compensate for optimal focal length 116 as necessary. Alternatively, the CCD image sensor 112 could be fixed and the DMD 106 could be the device that is switched in or out of the optic path.

FIGS. 5A-5B illustrate another embodiment whereby a CCD image sensor 112 may be adjacent to a DMD 106 with their backs (non- functional surfaces) to each other on a circular turret-like structure 126. Also, the turret-like structure 126 need not be circular as long as it can substantially rotate about at least one axis. Alternatively, the CCD image sensor 112 and the DMD 106 may be flip-chip packaged together to a common substrate or circuit board. The CCD image sensor 112 and the DMD 106 may also be formed on the same semiconductor substrate. In FIG. 5A projection mode 122, the DMD 106 is blocking the CCD image sensor 112 thereby allowing light from the DMD 106 to be focused by the projection lens 108 and projected out onto a screen 110. hi FIG. 5B camera mode 124, the

circular turret-like structure 126 rotates thereby exposing the CCD image sensor 112 to the optic path rather than the DMD 106. As a result, an incoming image 114 may be focused by the camera lens 108 and captured by the CCD image sensor 112. The camera lens 108 may not have to refocus the incoming image 114 because the CCD image sensor 112 and the DMD 106 may be situated at the same focal length 116. Alternatively, the circular turret- type structure 126 may make full or partial rotations.

FIGS. 6A-6B illustrate another embodiment whereby a CCD image sensor 112 may be placed adjacent to a DMD 106 on a rectangular structure 128. The rectangular structure 128 need not be rectangular as long as the structure 128 can substantially translate about an axis. Additionally, the CCD image sensor 112 and the DMD 106 may be formed next to each other on the same semiconductor substrate or mounted together to a common substrate or circuit board in a multi-chip module. In FIG. 6A projection mode 122, the rectangular structure 128 translates in one direction (in this case upward as is shown in the FIG.) so that only the DMD 106 is exposed to the optic path thereby allowing light from the DMD 106 to be focused by the projection lens 108 and projected out onto a screen 110. In FIG. 6B camera mode 124, the rectangular structure 128 translates in the opposite direction (downward) thereby exposing only the CCD image sensor 112 to the optic path. As a result, the camera lens 108 focuses the incoming image 114 to be captured and stored by the CCD image sensor 112. No refocusing of the lens 108 may be necessary because the CCD image sensor 112 and the DMD 106 may be situated at the same focal length 116. Alternatively, the rectangular structure 128 may translate along more than one axis.

FIGS. 7A-7B illustrate another embodiment whereby a CCD image sensor 112 and a DMD 106 are each supported by a support structure 130. The CCD image sensor 112 and the DMD 106 may also be formed next to each other on the same semiconductor substrate, and maintained together as a single unit by a single support structure 130. In FIG. 7 A projection mode 122, the support structure 130 for the DMD 106 is at the 12 o'clock position while the support structure 130 for the CCD image sensor 112 is at the 2 o'clock position. In this mode, the DMD 106 support structure 130 lines up the DLP chip 106 to the optic path thereby allowing light from the DMD 106 to be focused by the projection lens 108 and projected out onto a screen (not shown). The optic path is normal (coming out of the paper) to the DMD 106 while the projection lens 108 is parallel with the DMD 106 and is illustrated

as being on top of the DMD 106. In FIG. 7B camera mode 124, the DMD 106 support structure 130 moves or rocks from the 12 o'clock position (in projection mode 122) to the 10 o'clock position (in camera mode 124), thereby taking the DLP chip 106 out of the optic path. Additionally, the camera lens 108 support structure 130 moves or rocks from the 2 o'clock position (in projection mode 122) to the 12 o'clock position (in camera mode 124) thereby lining up the CCD image sensor 112 to the optic path and allowing an incoming image (not shown) to be focused by the camera lens 108 and captured and stored by the CCD image sensor 112. Alternatively, the support structures 130 may "rock" optical devices 106, 112 into position (into an optic path) by various switching mechanisms including translating, rotating, or combinations thereof. Also, the degree or amount of moving or rocking need not have a fixed magnitude (from 12 o'clock to 10 o'clock), but may vary depending on design and device constraints.

FIGS. 8A-8B illustrate another embodiment whereby a lens 108 switches back and forth between FIG. 8 A projection mode 122 and FIG. 8B camera mode 124. As illustrated, a CCD image sensor 112 is adjacent to a DMD 106. The two devices 112, 106 may also be formed on the same semiconductor substrate or mounted to a common substrate or circuit board. Furthermore, the processing electronics (not shown) for the two optical devices 112, 106 may be integrated. In FIG. 8 A projection mode 122, a projection lens 108 resides within an optic path of the DMD 106 thereby allowing light from the DMD 106 to be focused by the projection lens 108 and projected out onto a screen 110. In FIG. 8B camera mode 124, a camera lens 108 resides within an optic path of the CCD image sensor 112 thereby allowing an incoming image 114 to be focused by the camera lens 108 and captured and stored by the CCD image sensor 112. The lens 108 switches back and forth depending on the mode of operation 122, 124, and may also automatically or manually refocus to compensate for optimal focal length 116 as necessary. The various switching mechanisms may include translating, rotating, or combinations thereof.

FIG. 9 illustrates another embodiment whereby two lenses 108 are provided within an optical projection system. As illustrated, a projection lens 108 resides in a DMD's 106 optic path during projection mode 122, and a camera lens 108 resides in a CCD image sensor's 112 optic path during camera mode 124. The two lenses 108 need not be the same and may be optimized based on the type of optical devices 112, 106 that are used. The lenses 108 may

also have different magnification and resolution depending on the size of the DMD 106 and the size of the CCD image sensor 112. In addition, although the CCD image sensor 112 is adjacent to the DMD 106, the two devices 112, 106 may be formed on the same semiconductor substrate or mounted to a common substrate or circuit board. Furthermore, the processing electronics (not shown) of the two devices 112, 106 may be integrated. In projection mode 122, light from the DMD 106 may be focused by the projection lens 108 and projected out onto a screen 110, while in camera mode 124, an incoming image 114 is focused by the camera lens 108 and captured and stored by the CCD image sensor 112. The two lenses 108 may also allow images to be captured and projected simultaneously.

FIGS. 10A- 1OB illustrate yet another embodiment whereby a CCD or a CMOS image sensor 112 may be integrated with a DMD 106 on the same semiconductor substrate. FIG. 1OA illustrates a top-down view of a 3x3 array of DMD cells 107. There may be thousands or millions of these DMD cells or pixels 107 within a DMD chip 106. Because of the nature of the DMD chip 106, there are areas 132 on the die surface that are not completely covered by the pixel mirrors 107. These uncovered areas 132 are spacings or gaps between the DMD pixels 107 that must exist in order for the pixels 107 to actuate or tilt. For a typical DMD chip 106 today, the unused area 132 is approximately equivalent to a pixel cell area for a CCD or a CMOS image sensor 112. Therefore, it is feasible to add camera functionality to the semiconductor substrate of the DMD chip 106 in these unused areas 132 thereby providing dual functionality in a single chip without degrading the function or utility of either. Furthermore, with the coming of wafer-level packaging of DMD chips 106, there will be other large areas (not shown) of unused silicon around the perimeter of a DMD chip 106 that could also be used to include the imaging CCD or CMOS circuitry 112.

FIG. 1OB further illustrates additional advantages of integrating a CCD or a CMOS imaging sensor 112 with a DMD chip 106 on the same semiconductor substrate. The 3x3 array of DMD cells 107 of FIG. 1OB is similar to that of FIG. 1OA except that the DMD mirrors 107 in FIG. 1OB are actuating to one side, as is illustrated by the slight tilting of the DMD mirrors 107. Depending on whether the DMD mirrors 107 are operating in an "on" or "off state, they will tilt to a certain angle. As a result, additional light may be captured or collected by a CCD or CMOS image cell 112 within an optical projection system 100. As is shown in the system 100, the top and the bottom of the DMD mirrors 107 may be deposited

with the same material, typically aluminum or some other reflective metallic material. As an incoming light or image 114 is collected by a camera lens 108 and is being focused upon the DMD mirrors 107, it is once reflected by the top surface of the DMD mirror 107 towards an adjacent or neighboring DMD mirror 107. The once-reflected light 134 can then be twice reflected by the bottom surface of the neighboring DMD mirror 107. The twice-reflected light 136 is then captured or collected by the CCD or CMOS image cell 112 that lies between unused areas 132 of a DMD chip 106. In other words, when the DMD mirrors 107 substantially actuate in one direction such that the electronic device is being used in camera mode, they form a rhomboid reflector or periscope action which helps to guide more light to be captured or collected by the CCD/CMOS cells 112 situated underneath the DMD mirrors 107. Additionally, there may be multiple reflections (not shown) before the CCD/CMOS cells 112 capture the additional light. Also, the CCD/CMOS cells 112 may capture an incoming light directly without any reflection by the DMD mirrors 107.

Other advantages that could result in low cost by adding functionality due to sharing of many components, especially electronics and optics, may include multi-functional use of the common optics including integrating projector and camera image processing electronics on a single chip. Furthermore, additional functionalities may include sharing a single dynamic random access memory (DRAM) chip to store images from the projector and the camera, sharing a system control microprocessor, or sharing FLASH memory for programming both camera control operations and projector control operations. Also, power supply and battery, as well as universal serial bus (USB) ports and other input/output (I/O) ports may also be shared. In addition, a new digital signal processing (DSP) chip integrating many of these functions may also be added to the electronic device.

It will be appreciated by those of ordinary skill in the art that the invention can be embodied in other specific forms without departing from the breadth or essential character thereof. For example, although an image-capturing device such as a CCD or CMOS image sensor may be integrated within an optical projection system, an image-projecting device such as a DMD or a DLP chip may be integrated within an optical imaging system like a digital camera or camcorder or even with a cellular phone or hand-held gaming device. In addition, although several embodiments have been illustrated, other orientations of the image sensor (CCD or CMOS) and image projector (DMD and DLP) not shown may nevertheless

work encompassing the same or similar concepts of the disclosed embodiments. The disclosed embodiments are therefore considered in all respects to be illustrative and not restrictive.