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Title:
APPARATUS FOR PLANNING CUTTING PATH OF SURGICAL ROBOT, AND METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/063539
Kind Code:
A1
Abstract:
The present invention relates to an apparatus for planning a cutting path of a surgical robot, and a method thereof. The method for planning a cutting path of a surgical robot, according to the present invention, comprises the steps of: determining the position and stance of an implant to be installed in a target bone for surgery on the basis of a 3D model of the target bone for surgery; determining a cutting surface of the target bone for surgery that requires cutting for installation of the implant; determining a cutting start location at which the surgical robot starts cutting with respect to the cutting surface, and an entrance direction of the surgical robot at the cutting start location; setting a maximum area in which a cutting path can be defined by the surgical robot on the basis of the cutting start location and the entering direction; generating a transformed 3D model that virtually reflects a cutting state of the cutting surface; and generating a cutting path of the surgical robot that starts from the cutting start location within the maximum area on the basis of the transformed 3D model. Through this, the surgical effect may be further improved by automatically generating a patient-customized cutting path that takes into account the bone diversity of each patient.

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Inventors:
LEE JAE JUN (KR)
KIM BONG OH (KR)
Application Number:
PCT/KR2023/014301
Publication Date:
March 28, 2024
Filing Date:
September 20, 2023
Export Citation:
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Assignee:
CUREXO INC (KR)
International Classes:
A61B34/10; A61B34/00; A61B34/30
Foreign References:
KR20210097909A2021-08-10
KR20200066385A2020-06-09
KR20190031281A2019-03-25
KR20210029322A2021-03-16
KR20220072407A2022-06-02
KR20150125069A2015-11-09
Attorney, Agent or Firm:
NAMCHON INTERNATIONAL PATENT AND LAW FIRM (KR)
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