APPARATUS FOR PRODUCING WAFER LENS, DIE, AND PROCESS FOR PRODUCING WAFER LENS

WIPO Patent Application WO/2011/024630

A1

A process for producing a wafer lens is disclosed in which a resin that has been cured is prevented from having projections or deficient parts. The process comprises a dispense step in which a resin is dropped onto a die that has a plurality of cavities arranged so as to leave spaces therebetween, an alignment step in which the position of the die relative to a glass substrate is adjusted, an imprint step in which one of the die and the glass substrate is pressed against the other, a curing step in which the resin is cured, and a separation step in which the glass substrate is separated from the die, the steps ranging from the dispense step to the separation step being repeated as one cycle to successively form resinous lens parts on the glass substrate, wherein in the alignment step in each cycle, the cavities of the die are disposed between the formed lens parts.

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FUJII YUITI (JP)
IWAIDA KENICHI (JP)
TERAMOTO TOUGO (JP)
IMAI TOSHIYUKI (JP)
SATO AKIRA (JP)
HOSOE SHIGERU (JP)

PCT/JP2010/063461

March 03, 2011

August 09, 2010

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KONICA MINOLTA OPTO INC (JP)
FUJII YUITI (JP)
IWAIDA KENICHI (JP)
TERAMOTO TOUGO (JP)
IMAI TOSHIYUKI (JP)
SATO AKIRA (JP)
HOSOE SHIGERU (JP)

B29C39/10; B29C33/42; B29C39/24; B29C39/26; G02B3/00; B29L11/00

JP2009088264A	2009-04-23
JP2005286062A	2005-10-13
JP2003094445A	2003-04-03
JP3926380B1	2007-06-06

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