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Patent Searching and Data


Title:
APPLICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/239841
Kind Code:
A1
Abstract:
[Problem] To provide an application device capable of applying, with high accuracy, a film forming liquid to an outer peripheral end face of a work having a noncircular shape with a coating width that is equal to or less than the thickness of the work. [Solution] A rotation mechanism part 20 is configured such that a work 2 and a copying mold 22 that has a shape identical to the outline of the work 2 can synchronously rotate around the same rotational axis. An application mechanism part 30 comprises: a pressing roller 31 that can rotate together with the copying mold 22 in the state of being pressed against an outer peripheral end face 22a of the copying mold 22; an application part 32 including an application roller 33 for applying a film forming liquid 3 to an outer peripheral end face 2a of the work 2 while rotating together with the work 2 in the state of being pressed against the outer peripheral end face 2a of the work 2; and a rotation transmission mechanism 40 that causes the pressing roller 31 and the application roller 33 which have the same outer diameter to synchronously rotate.

Inventors:
YOSHIZUKA HIDETO (JP)
MATSUYAMA TAKAO (JP)
Application Number:
PCT/JP2022/020107
Publication Date:
November 17, 2022
Filing Date:
May 12, 2022
Export Citation:
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Assignee:
ENATECH CORP (JP)
International Classes:
B05C1/02; B05C13/02
Foreign References:
JPH03296459A1991-12-27
JP2011253161A2011-12-15
JP2010131508A2010-06-17
JPH03184002A1991-08-12
JP2017154077A2017-09-07
JP2010131554A2010-06-17
JPH0651105A1994-02-25
JPH0780371A1995-03-28
Attorney, Agent or Firm:
IUCHI Ryuji et al. (JP)
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