APPLICATION TYPE THIN PLATE REINFORCING MATERIAL COMPOSITION

Title:

APPLICATION TYPE THIN PLATE REINFORCING MATERIAL COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2002/061178

Kind Code:

A1

Abstract:

An application type thin plate reinforcing material composition, for example, for use in a car body, characterized in that it comprises a liquid epoxy resin, a latent curing agent and an inorganic filler having an aspect ratio (L/D) of 5 or more, it contains said inorganic filler in an amount of 20 to 50 wt %, it is a highly viscous material. The thin plate reinforcing material composition can be used by application and heating for securing a satisfactory tensile rigidity or dent resistance of a thin plate which has become thinner with the weight reduction of a car body, or for safety in collision, and can improve the flexural strength and rigidity of said thin plate with causing no strain to the plate.

Inventors:

UKAI MASAKI (JP)
SUGIURA YUTAKA (JP)
MIYAMOTO MUTSUHISA (JP)

Application Number:

PCT/JP2002/000757

Publication Date:

August 08, 2002

Filing Date:

January 31, 2002

Export Citation:

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Assignee:

SUNSTAR ENGINEERING INC (JP)
UKAI MASAKI (JP)
SUGIURA YUTAKA (JP)
MIYAMOTO MUTSUHISA (JP)

International Classes:

B05D7/14; B05D7/00; B05D7/16; B05D7/24; C08G59/42; C08G59/46; C09D5/00; C09D163/00; C25D13/00; (IPC1-7): C23C26/00; C09D163/00

Foreign References:

JPH06172617A

1994-06-21

Other References: