Title:
APPLICATOR, MICRONEEDLE PATCH KIT, AND PUNCTURE METHOD
Document Type and Number:
WIPO Patent Application WO/2021/251464
Kind Code:
A1
Abstract:
This applicator for puncturing the skin with a microneedle array (4) is provided with: a holding unit (211) for holding the microneedle array (4); and a puncture promotion unit (223) that forms a puncture completion state in which a central array region of the microneedle array (4) protrudes towards the skin beyond a peripheral array region provided closer to the periphery of the microneedle array (4) than the central array region.
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Inventors:
KOBAYASHI KATSUNORI (JP)
HAMAMOTO HIDETOSHI (JP)
HAMAMOTO HIDETOSHI (JP)
Application Number:
PCT/JP2021/022133
Publication Date:
December 16, 2021
Filing Date:
June 10, 2021
Export Citation:
Assignee:
MEDRX CO LTD (JP)
International Classes:
A61M37/00
Domestic Patent References:
| WO2016129184A1 | 2016-08-18 | |||
| WO2019216097A1 | 2019-11-14 | |||
| WO2019176900A1 | 2019-09-19 |
Foreign References:
| JP2013158601A | 2013-08-19 | |||
| JP2008520369A | 2008-06-19 |
Attorney, Agent or Firm:
KAMATA, Toru et al. (JP)
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