Title:
APPLICATOR
Document Type and Number:
WIPO Patent Application WO/2024/084720
Kind Code:
A1
Abstract:
An applicator is provided, with which an even coating film having a sufficient thickness can be ensured and a coating operation can be easily conducted without using a coating material in excess. An applicator main body 10 including brushes 20 each having a coating material adherent thereto is put over a bolt 1, a nut 2, and a washer 4 and is rotationally moved in the circumferential direction. Thus, the brushes 20 disposed in a plurality of portions of the applicator main body 10 along the circumferential direction simultaneously apply the coating material. In doing so, since the brushes 20 are covered by the applicator main body 10, the coating material is not scattered to the outside of the applicator main body 10 even when the brushes 20 are rotated together with the applicator main body 10. In addition, the coating material which has been adhered to the inner surface of the applicator main body 10 and flowed down gathers in a coating material receiving part 11 at the opening rim of the applicator main body 10. The coating material hence does not drip outward from the opening rim of the applicator main body 10.
More Like This:
| WO/2016/102307 | FLUID APPLICATION DEVICE |
Inventors:
MUKAWA SATOSHI (JP)
NAKAMURA YOSHIHIKO (JP)
NAKAMURA YOSHIHIKO (JP)
Application Number:
PCT/JP2023/007752
Publication Date:
April 25, 2024
Filing Date:
March 02, 2023
Export Citation:
Assignee:
IHI INFRASTRUCTURE SYS CO LTD (JP)
International Classes:
B05C1/02; B05B3/02; B05C11/10; B05C17/00
Domestic Patent References:
| WO2014087761A1 | 2014-06-12 |
Foreign References:
| JP2021194607A | 2021-12-27 | |||
| JP2021190511A | 2021-12-13 | |||
| JP2002254015A | 2002-09-10 | |||
| JP3126247U | 2006-10-19 | |||
| JP2004016305A | 2004-01-22 | |||
| JP2001046150A | 2001-02-20 | |||
| JPS6316879U | 1988-02-04 |
Attorney, Agent or Firm:
ATENDA PATENT FIRM (JP)
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