Title:
AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/067923
Kind Code:
A1
Abstract:
Provided are: an aqueous dispersion for chemical mechanical polishing, which contains silica particles and is capable of polishing a silicon oxide film at a higher rate than conventional aqueous dispersions for chemical mechanical polishing in a process wherein a surface to be polished having the silicon oxide film is polished; and a chemical mechanical polishing method which uses this aqueous dispersion for chemical mechanical polishing.
An aqueous dispersion for chemical mechanical polishing according to the present invention is characterized by containing silica particles that satisfy the conditions (1)-(3) described below and by having a pH of from 2 to 5 (inclusive).
(1) The silica particles have an average particle diameter of 30 nm or more as determined by means of a transmission electron microscope.
(2) The silica particles have a ξ potential of +5 mV or more at a pH of from 2 to 5 (inclusive).
(3) The silica particles have chained spherical shapes obtained by connecting a plurality of silica particles that are primary particles, or alternatively have recessed and projected shapes.
Inventors:
SHINOMURA HISASHI (JP)
YOSHIO KOUHEI (JP)
YAMANAKA TATSUYA (JP)
NISHIMOTO KAZUO (JP)
YOSHIO KOUHEI (JP)
YAMANAKA TATSUYA (JP)
NISHIMOTO KAZUO (JP)
Application Number:
PCT/JP2015/079111
Publication Date:
May 06, 2016
Filing Date:
October 15, 2015
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| WO2013137220A1 | 2013-09-19 | |||
| WO2010035613A1 | 2010-04-01 |
Foreign References:
| JP2007103463A | 2007-04-19 | |||
| JP2010092968A | 2010-04-22 |
Attorney, Agent or Firm:
OFUCHI, Michie et al. (JP)
Obuchi Yoshikazu glory (JP)
Obuchi Yoshikazu glory (JP)
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