Title:
AQUEOUS EMULSION RESIN COMPOSITIONS
Document Type and Number:
WIPO Patent Application WO/2003/002660
Kind Code:
A1
Abstract:
Resin compositions containing at least one fluoroolefin polymer having crosslinkable group(s) at a terminus and&sol or a side chain of its molecule and at least one non−fluoroolefin polymer having crosslinkable group(s) at a terminus and&sol or a side chain of its molecule&semi aqueous emulsion resin compositions containing at least one hardener selected from the group consisting of isocyanate, melamine, hydrazide, carbodiimide, silane and epoxy compounds&semi and aqueous emulsion resin compositions containing at least one chemically bonded product of a fluoroolefin polymer and a non−fluoroolefin polymer bonded to each other via at least one covalent bond at a terminus and&sol or a side chain of the molecules wherein one or both of the fluoroolefin polymer and the non−fluoroolefin polymer have crosslinkable group(s).
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Inventors:
MITSUHATA NOBUO (JP)
FUWA TSUNEHIKO (JP)
WADA SUSUMU (JP)
KUNIMASA KEIKO (JP)
MOURI HARUHIKO (JP)
FUKITA NOBUO (JP)
FUWA TSUNEHIKO (JP)
WADA SUSUMU (JP)
KUNIMASA KEIKO (JP)
MOURI HARUHIKO (JP)
FUKITA NOBUO (JP)
Application Number:
PCT/JP2002/006539
Publication Date:
January 09, 2003
Filing Date:
June 28, 2002
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
MITSUHATA NOBUO (JP)
FUWA TSUNEHIKO (JP)
WADA SUSUMU (JP)
KUNIMASA KEIKO (JP)
MOURI HARUHIKO (JP)
FUKITA NOBUO (JP)
MITSUHATA NOBUO (JP)
FUWA TSUNEHIKO (JP)
WADA SUSUMU (JP)
KUNIMASA KEIKO (JP)
MOURI HARUHIKO (JP)
FUKITA NOBUO (JP)
International Classes:
C08F259/08; C08L27/16; C09D127/12; C09D127/16; C08K5/00; C08L33/06; (IPC1-7): C08L27/12
Foreign References:
JP2002179871A | 2002-06-26 | |||
JPH1129348A | 1999-02-02 | |||
JP2000129195A | 2000-05-09 | |||
JP2001072819A | 2001-03-21 | |||
JPH07324180A | 1995-12-12 | |||
JP2002194264A | 2002-07-10 | |||
JPH0867795A | 1996-03-12 | |||
JPH02132101A | 1990-05-21 |
Other References:
See also references of EP 1411085A4
Attorney, Agent or Firm:
Saegusa, Eiji (Doshomachi Chuo-ku Osaka-shi, Osaka, JP)
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